公开(公告)号：US20230014913A1

公开(公告)日：2023-01-19

申请号：US17686856

申请日：2022-03-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Po-Yuan Cheng ,  Pu Wang ,  Li-Hui Cheng

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48

Abstract: In an embodiment, a device includes: a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component, the integrated circuit die exposed at a back-side of the package component; a heat dissipation layer on the back-side of the package component and on sidewalls of the package component; an adhesive layer on a back-side of the heat dissipation layer, a portion of a sidewall of the heat dissipation layer being free from the adhesive layer; and a package substrate connected to the conductive connectors.