公开(公告)号：US20230378020A1

公开(公告)日：2023-11-23

申请号：US18446014

申请日：2023-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/373 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10

CPC classification number: H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/373 ,  H01L24/73 ,  H01L21/4882 ,  H01L25/50 ,  H01L24/16 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/73204 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/182 ,  H01L2924/35121 ,  H01L2924/3511 ,  H01L2224/16237 ,  H01L2224/32225

Abstract: A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.

公开(公告)号：US20220384355A1

公开(公告)日：2022-12-01

申请号：US17818797

申请日：2022-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065

Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

公开(公告)号：US11450654B2

公开(公告)日：2022-09-20

申请号：US16925326

申请日：2020-07-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Fu Tsai ,  Chin-Fu Kao ,  Pu Wang ,  Szu-Wei Lu

IPC: H01L21/50 ,  H01L25/18

Abstract: A package structure includes a circuits substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.

公开(公告)号：US11152330B2

公开(公告)日：2021-10-19

申请号：US16385242

申请日：2019-04-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Chieh Li ,  Pu Wang ,  Chih-Wei Wu ,  Ying-Ching Shih ,  Szu-Wei Lu

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00

Abstract: A method for forming a semiconductor package structure includes stacking chips to form a chip stack over an interposer. The method also includes disposing a semiconductor die over the interposer. The method also includes filling a first encapsulating layer between the chips and surrounding the chip stack and the semiconductor die. The method also includes forming a second encapsulating layer covering the chip stack and the semiconductor die. The first encapsulating layer fills the gap between the chip stack and the semiconductor die.

公开(公告)号：US10510732B2

公开(公告)日：2019-12-17

申请号：US15854755

申请日：2017-12-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsien-Ju Tsou ,  Chih-Wei Wu ,  Jing-Cheng Lin ,  Pu Wang ,  Szu-Wei Lu ,  Ying-Ching Shih

IPC: H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538

Abstract: Provided are a PoP device and a method of manufacturing the same. The PoP device includes a first package structure and a second package structure. The first package structure includes a die, a through integrated fan-out via (TIV), an encapsulant, and a film. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and sidewalls of the TIV. The film is over the TIV and the encapsulant, and aside the die. The second package structure is connected to the first package structure through a connector. The connector penetrates through the film to electrically connected to the TIV.

公开(公告)号：US20190103387A1

公开(公告)日：2019-04-04

申请号：US15854755

申请日：2017-12-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsien-Ju Tsou ,  Chih-Wei Wu ,  Jing-Cheng Lin ,  Pu Wang ,  Szu-Wei Lu ,  Ying-Ching Shih

IPC: H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538

Abstract: Provided are a PoP device and a method of manufacturing the same. The PoP device includes a first package structure and a second package structure. The first package structure includes a die, a through integrated fan-out via (TIV), an encapsulant, and a film. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and sidewalls of the TIV. The film is over the TIV and the encapsulant, and aside the die. The second package structure is connected to the first package structure through a connector. The connector penetrates through the film to electrically connected to the TIV.

公开(公告)号：US12278162B2

公开(公告)日：2025-04-15

申请号：US18366481

申请日：2023-08-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hsun Wang ,  Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/433 ,  H01L23/367 ,  H01L25/00 ,  H01L25/065 ,  H01L23/498 ,  H01L25/18

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

公开(公告)号：US20240395727A1

公开(公告)日：2024-11-28

申请号：US18790119

申请日：2024-07-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10

Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

公开(公告)号：US11990429B2

公开(公告)日：2024-05-21

申请号：US17994548

申请日：2022-11-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Wei Wu ,  Ying-Ching Shih ,  Kung-Chen Yeh ,  Li-Chung Kuo ,  Pu Wang ,  Szu-Wei Lu

IPC: H01L23/00 ,  H01L21/3105 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/18

CPC classification number: H01L23/562 ,  H01L21/31053 ,  H01L21/486 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49827 ,  H01L25/18 ,  H01L25/50

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

公开(公告)号：US20240038623A1

公开(公告)日：2024-02-01

申请号：US17815629

申请日：2022-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ping-Yin Hsieh ,  Chih-Hao Chen ,  Yi-Huan Liao ,  Pu Wang ,  Li-Hui Cheng

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/3735 ,  H01L23/3675 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4871 ,  H01L21/563 ,  H01L21/565

Abstract: In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includes a back-side metal layer on a back-side of the package component. The device also includes an indium thermal interface material on a back-side of the back-side metal layer. The device also includes a lid on a back-side of the indium thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.