公开(公告)号：US20200292932A1

公开(公告)日：2020-09-17

申请号：US16354015

申请日：2019-03-14

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chia-Yu LEE ,  Tao-Hsin CHEN ,  Ching-Juinn HUANG ,  Po-Chung CHENG

IPC: G03F1/00 ,  H01L21/683 ,  H01L21/68 ,  G03F7/20

Abstract: In some embodiments, a reticle structure is provided. The reticle structure includes a reticle stage and a reticle mounted on the reticle stage. The reticle stage includes plural first burls and plural second burls, in which the second burls are disposed on a center of the reticle stage and the first burls disposed on an edge of the reticle stage such that the first burls surround the second burls. The reticle includes a base material and a pattern layer overlying the base material. The base material is secured on the first and second burls of the reticle stage. The pattern layer includes plural first gratings, and each of the first burls is vertically aligned with one of the first gratings.

公开(公告)号：US20200033717A1

公开(公告)日：2020-01-30

申请号：US16359073

申请日：2019-03-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Yu LEE ,  Tao-Hsin CHEN ,  Chia-Hao HSU ,  Ching-Juinn HUANG ,  Po-Chung CHENG

IPC: G03F1/24 ,  H01L21/033 ,  H01L29/06

Abstract: A reticle stage is provided, including an electrostatic chuck and an acoustic wave transducer. The electrostatic chuck includes multiple chucking electrodes embedded in a dielectric body and configured to secure a reticle to a chuck surface of the dielectric body by electrostatic attraction. The acoustic wave transducer is disposed on the chuck surface and configured to impart a surface acoustic wave to the chuck surface to vibrate the chuck surface, thereby removing the reticle from the reticle stage.