公开(公告)号：US20200041914A1

公开(公告)日：2020-02-06

申请号：US16279237

申请日：2019-02-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kai-Chieh CHANG ,  Tsung-Hsun LEE ,  Ching-Juinn HUANG ,  Li-Jui CHEN ,  Po-Chung CHENG

IPC: G03F7/20

Abstract: A lithography system is provided and includes a light source device configured to emit a processing light beam onto the semiconductor wafer, to generate a penetrating light beam and a reflected light beam. The lithography system further includes a detecting module having a first detector and a second detector. The first detector is configured to receive the penetrating light beam to generate first power data, and the second detector is configured to receive the reflected light beam to generate second power data. The lithography system also includes a monitoring device configured to calculate absorbed power data of the semiconductor wafer according to the first power data, the second power data and reference power data of a reference light beam and configured to compensate for a pattern formed on the semiconductor wafer resulting from the processing light beam according to the absorbed power data and reference information.

公开(公告)号：US20200310259A1

公开(公告)日：2020-10-01

申请号：US16901506

申请日：2020-06-15

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Hao-Yu LAN ,  Po-Chung CHENG ,  Ching-Juinn HUANG ,  Tzung-Chi FU ,  Tsung-Yen LEE

IPC: G03F9/00

Abstract: A system is disclosed. The system includes a cleaning device and a scanner device. The cleaning device is configured to clean a mask. The scanner device is coupled to the cleaning device and is configured to receive the mask, a reference image and a real-time image that is captured at the mask. The reference image includes at least one first mark image having a plurality of mapping marks on the mask. The real-time image includes at least one second mark image having the plurality of mapping marks on the mask. The scanner device is configured to map the at least one second mark image in the real-time image with the at least one first image in the reference image, when a lithography exposing process is performed. A method is also disclosed herein.

公开(公告)号：US20210389685A1

公开(公告)日：2021-12-16

申请号：US17459357

申请日：2021-08-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Hao-Yu LAN ,  Po-Chung CHENG ,  Ching-Juinn HUANG ,  Tzung-Chi FU ,  Tsung-Yen LEE

IPC: G03F9/00

Abstract: A system is disclosed. The system includes a cleaning device and a scanner device. The cleaning device is configured to clean a mask. The scanner device is coupled to the cleaning device and is configured to receive the mask, a reference image and a real-time image that is captured at the mask. The reference image includes at least one first mark image having a plurality of mapping marks on the mask. The real-time image includes at least one second mark image having the plurality of mapping marks on the mask. The scanner device is configured to map the at least one second mark image in the real-time image with the at least one first image in the reference image, when a lithography exposing process is performed. A method is also disclosed herein.

公开(公告)号：US20230266682A1

公开(公告)日：2023-08-24

申请号：US18310483

申请日：2023-05-01

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Hao-Yu LAN ,  Po-Chung CHENG ,  Ching-Juinn HUANG ,  Tzung-Chi FU ,  Tsung-Yen LEE

IPC: G03F9/00

CPC classification number: G03F9/7019

Abstract: A system is provided. The system includes an exposing device configured to generate a real-time image, including multiple first align marks, of a mask and an adjusting device configured to adjust an off-set of the mask from a pre-determined position to be smaller than a minimum aligning distance according to the first align marks and multiple align marks on a substrate, and further to move the mask closer to the pre-determined position to have a displacement, less than a minimum mapping distance, from the pre-determined position according to the real-time image and a reference image of the mask.

公开(公告)号：US20200292932A1

公开(公告)日：2020-09-17

申请号：US16354015

申请日：2019-03-14

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chia-Yu LEE ,  Tao-Hsin CHEN ,  Ching-Juinn HUANG ,  Po-Chung CHENG

IPC: G03F1/00 ,  H01L21/683 ,  H01L21/68 ,  G03F7/20

Abstract: In some embodiments, a reticle structure is provided. The reticle structure includes a reticle stage and a reticle mounted on the reticle stage. The reticle stage includes plural first burls and plural second burls, in which the second burls are disposed on a center of the reticle stage and the first burls disposed on an edge of the reticle stage such that the first burls surround the second burls. The reticle includes a base material and a pattern layer overlying the base material. The base material is secured on the first and second burls of the reticle stage. The pattern layer includes plural first gratings, and each of the first burls is vertically aligned with one of the first gratings.

公开(公告)号：US20200133143A1

公开(公告)日：2020-04-30

申请号：US16516452

申请日：2019-07-19

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Hao-Yu LAN ,  Po-Chung CHENG ,  Ching-Juinn HUANG ,  Tzung-Chi FU ,  Tsung-Yen LEE

IPC: G03F9/00

Abstract: A method includes the following operations. A reference image of a mask having a plurality of mapping marks is acquired. A lithography exposing process is performed by a scanner with the mask to a photoresist layer which is formed on a substrate. Performing the lithography exposing process includes mapping a real-time image of the mask with the reference image of the mask.

公开(公告)号：US20200035483A1

公开(公告)日：2020-01-30

申请号：US16182771

申请日：2018-11-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Siao-Chian HUANG ,  Po-Chung CHENG ,  Ching-Juinn HUANG ,  Tzung-Chi FU ,  Tsung-Yen LEE

IPC: H01L21/02 ,  B08B3/08 ,  B08B5/04 ,  G03F7/20 ,  H01L21/67

Abstract: A particle removal apparatus is provided. The particle removal apparatus includes a reticle holder configured to hold a reticle. The particle removal apparatus further includes a robotic arm. The particle removal apparatus also includes a particle removal device disposed on the robotic arm, and the particle removal device includes a solution spraying module. In addition, the robotic arm and the particle removal device are configured to align with a particle on a backside of the reticle, and the solution spraying module is configured to spray a solution onto the particle to remove the particle.

公开(公告)号：US20200033717A1

公开(公告)日：2020-01-30

申请号：US16359073

申请日：2019-03-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Yu LEE ,  Tao-Hsin CHEN ,  Chia-Hao HSU ,  Ching-Juinn HUANG ,  Po-Chung CHENG

IPC: G03F1/24 ,  H01L21/033 ,  H01L29/06

Abstract: A reticle stage is provided, including an electrostatic chuck and an acoustic wave transducer. The electrostatic chuck includes multiple chucking electrodes embedded in a dielectric body and configured to secure a reticle to a chuck surface of the dielectric body by electrostatic attraction. The acoustic wave transducer is disposed on the chuck surface and configured to impart a surface acoustic wave to the chuck surface to vibrate the chuck surface, thereby removing the reticle from the reticle stage.