-
公开(公告)号：US20230064162A1
公开(公告)日：2023-03-02
申请号：US17461656
申请日：2021-08-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Chieh Lee , Hung-Jui Kuo , Ming-Tan Lee , Ting Yi Lin
Abstract: A semiconductor device and method of manufacturing a semiconductor device is disclosed herein including creating a photoresist mixture that includes a surfactant, and a base solvent; one or more boiling point modifying solvents having a boiling point higher in temperature than the base solvent; and one or more hydrophilicity modifying solvents that are more hydrophilic than the base solvent; depositing the photoresist mixture onto a substrate comprising a plurality of UBMLs using a wet film process; performing a pre-bake process to cure the photoresist; and patterning the photoresist.
-
公开(公告)号：US20240393685A1
公开(公告)日：2024-11-28
申请号：US18790692
申请日：2024-07-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Chieh Lee , Hung-Jui Kuo , Ming-Tan Lee , Ting Yi Lin
Abstract: A semiconductor device and method of manufacturing a semiconductor device is disclosed herein including creating a photoresist mixture that includes a surfactant, and a base solvent; one or more boiling point modifying solvents having a boiling point higher in temperature than the base solvent; and one or more hydrophilicity modifying solvents that are more hydrophilic than the base solvent; depositing the photoresist mixture onto a substrate comprising a plurality of UBMLs using a wet film process; and performing a pre-bake process to cure the photoresist mixture.
-
Search Results
2
records
(took 0.014 seconds)
