公开(公告)号：US20240387193A1

公开(公告)日：2024-11-21

申请号：US18789076

申请日：2024-07-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Jui Kuo ,  Ming-Tan Lee ,  Chen-Cheng Kuo ,  De-Yuan Lu

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor device and method of making a conductive connector is provided. In an embodiment an opening is formed within a photoresist by adjusting the center point of an in-focus area during the exposure process. Once the photoresist has been developed to form an opening, an after development baking process is utilized to reshape the opening. Once reshaped, a conductive material is formed into the opening to take on the shape of the opening.

公开(公告)号：US20220359260A1

公开(公告)日：2022-11-10

申请号：US17872290

申请日：2022-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Ming-Tan Lee ,  Hung-Jui Kuo

IPC: H01L21/683 ,  H01L21/687 ,  B25B11/00 ,  H01L23/00

Abstract: An apparatus for securing a wafer includes a chuck, at least one O-ring disposed on the chuck, a vacuum system connected to the chuck, such that the vacuum system comprises a plurality of vacuum holes through the chuck connected to one or more vacuum pumps, and a controller configured to control the height of the at least one O-ring relative to the top surface of the chuck. The controller is connected to pressure sensors capable of detecting a vacuum. The at least one O-ring may include a plurality of O-rings.

公开(公告)号：US11189521B2

公开(公告)日：2021-11-30

申请号：US16590375

申请日：2019-10-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Chieh Wang ,  Hung-Jui Kuo ,  Jaw-Jung Shin ,  Ming-Tan Lee

IPC: H01L21/768 ,  H01L21/48

Abstract: Methods of manufacturing redistribution circuit structures are disclosed and one of the methods includes the following steps. A seed layer is formed over a die and an encapsulant encapsulating the die. A photoresist material is formed over the seed layer. The photoresist material is exposed through a phase shift mask to an I-line wavelength within an I-line stepper using a numerical aperture equal to or less than 0.18. The photoresist material is developed to form a photoresist layer including photoresist patterns and openings therebetween. A conductive material is formed in the openings. The photoresist patterns are removed to form conductive patterns. By using the conductive patterns as a mask, the seed layer is partially removed, to form seed layer patterns under the conductive patterns, wherein redistribution conductive patterns include the seed layer patterns and the conductive patterns respectively.

公开(公告)号：US12197138B2

公开(公告)日：2025-01-14

申请号：US17185827

申请日：2021-02-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzu-Cheng Lin ,  Chien Rhone Wang ,  Kewei Zuo ,  Ming-Tan Lee ,  Zi-Jheng Liu

IPC: G03F7/00 ,  G06F30/27 ,  G06F30/398 ,  G06N20/00

Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and machine learning are used to train a classification that correlates the overlay error source factors with overlay metrology categories. The overlay error source factors include tool signals. The trained classification includes a base classification and a Meta classification.

公开(公告)号：US20220336307A1

公开(公告)日：2022-10-20

申请号：US17809924

申请日：2022-06-30

Applicant: Taiwan Semiconductor Manufacturing Co,.Ltd.

Inventor： Hung-Jui Kuo ,  Tai-Min Chang ,  Hui-Jung Tsai ,  De-Yuan Lu ,  Ming-Tan Lee

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/48

Abstract: A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically coupling to the first plurality of through-vias. The first plurality of through-vias include an array. The second plurality of through-vias are outside of the first array, and the second plurality of through-vias are larger than the first plurality of through-vias.

公开(公告)号：US12148651B2

公开(公告)日：2024-11-19

申请号：US17872290

申请日：2022-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Ming-Tan Lee ,  Hung-Jui Kuo

IPC: H01L21/683 ,  B25B11/00 ,  H01L21/687 ,  H01L23/00

Abstract: An apparatus for securing a wafer includes a chuck, at least one O-ring disposed on the chuck, a vacuum system connected to the chuck, such that the vacuum system comprises a plurality of vacuum holes through the chuck connected to one or more vacuum pumps, and a controller configured to control the height of the at least one O-ring relative to the top surface of the chuck. The controller is connected to pressure sensors capable of detecting a vacuum. The at least one O-ring may include a plurality of O-rings.

公开(公告)号：US11960211B2

公开(公告)日：2024-04-16

申请号：US17371204

申请日：2021-07-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Jui Kuo ,  Ting-Yang Yu ,  Ming-Tan Lee

IPC: G03F7/00 ,  G03F1/46 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10

CPC classification number: G03F7/70191 ,  G03F1/46 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/568 ,  H01L24/82 ,  H01L24/97 ,  H01L25/105

Abstract: In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.

公开(公告)号：US20210118697A1

公开(公告)日：2021-04-22

申请号：US17114019

申请日：2020-12-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Jui Kuo ,  Ming-Tan Lee ,  Chen-Cheng Kuo ,  De-Yuan Lu

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00

Abstract: A semiconductor device and method of making a conductive connector is provided. In an embodiment an opening is formed within a photoresist by adjusting the center point of an in-focus area during the exposure process. Once the photoresist has been developed to form an opening, an after development baking process is utilized to reshape the opening. Once reshaped, a conductive material is formed into the opening to take on the shape of the opening.

公开(公告)号：US20190393150A1

公开(公告)日：2019-12-26

申请号：US16016669

申请日：2018-06-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Zi-Jheng Liu ,  Hung-Jui Kuo ,  Ming-Tan Lee

IPC: H01L23/522 ,  H01L23/00 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor package including a substrate and a redistribution structure is provided. The substrate has at least one contact. The redistribution structure is disposed on the substrate and electrically connected to the at least one contact. The redistribution structure includes a plurality of redistribution layers, and each of the redistribution layers includes a conductive material layer, a first dielectric material layer and a second dielectric material layer. The conductive material layer has via portions and body portions located on the via portions. The first dielectric material layer is surrounding the via portions of the conductive material layer. The second dielectric material layer is disposed on the first dielectric material layer and surrounding the body portions of the conductive material layer, wherein a material of the second dielectric material layer is different than a material of the first dielectric material layer.

公开(公告)号：US20240395595A1

公开(公告)日：2024-11-28

申请号：US18788481

申请日：2024-07-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Ming-Tan Lee ,  Hung-Jui Kuo

IPC: H01L21/683 ,  B25B11/00 ,  H01L21/687 ,  H01L23/00

Abstract: An apparatus for securing a wafer includes a chuck, at least one O-ring disposed on the chuck, a vacuum system connected to the chuck, such that the vacuum system comprises a plurality of vacuum holes through the chuck connected to one or more vacuum pumps, and a controller configured to control the height of the at least one O-ring relative to the top surface of the chuck. The controller is connected to pressure sensors capable of detecting a vacuum. The at least one O-ring may include a plurality of O-rings.