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公开(公告)号：US11626304B2
公开(公告)日：2023-04-11
申请号：US17178929
申请日：2021-02-18
发明人： Tzu-Cheng Lin , Y. Y. Peng , Jerry Wang , Kewei Zuo , Chien Rhone Wang
摘要： The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
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公开(公告)号：US10964566B2
公开(公告)日：2021-03-30
申请号：US16405702
申请日：2019-05-07
发明人： Tzu-Cheng Lin , Y.Y. Peng , Jerry Wang , Kewei Zuo , Chien Rhone Wang
摘要： The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
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3.发明授权公开(公告)号：US09390491B2
公开(公告)日：2016-07-12
申请号：US13753607
申请日：2013-01-30
发明人： Kewei Zuo , Chien Rhone Wang , Tzu-Cheng Lin , Chih-Wei Lai
CPC分类号： G06T7/001 , G06T2207/10056 , G06T2207/30148 , G06T2207/30152 , H04N7/18
摘要： A system and method is disclosed for a quality control and/or inspection procedure for assembly line processes. The disclosed system and method enable automatic optical inspection of a device during different stages of manufacture as well as in its finished form. The disclosed system and method enable the automatic quality control process to be self-learning, dynamic, and to identify and classify defects in real time.
摘要翻译： 公开了用于装配线工艺的质量控制和/或检验程序的系统和方法。 所公开的系统和方法使得能够在制造的不同阶段以及其完成形式中对装置进行自动光学检查。 所公开的系统和方法使得自动质量控制过程能够自学习，动态化，并且实时地识别和分类缺陷。
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公开(公告)号：US20200006102A1
公开(公告)日：2020-01-02
申请号：US16405702
申请日：2019-05-07
发明人： Tzu-Cheng Lin , Y.Y. Peng , Jerry Wang , Kewei Zuo , Chien Rhone Wang
摘要： The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
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