公开(公告)号：US20230298919A1

公开(公告)日：2023-09-21

申请号：US18201099

申请日：2023-05-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Kai-Chieh HUANG ,  Wei-Ting HSIAO ,  Yang-Ann CHU ,  I-Lun YANG ,  Hsuan LEE

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67745 ,  B65G47/90 ,  H01L21/67294 ,  H01L21/67333

Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

公开(公告)号：US20220319890A1

公开(公告)日：2022-10-06

申请号：US17849337

申请日：2022-06-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Kai-Chieh HUANG ,  Wei-Ting HSIAO ,  Yang-Ann CHU ,  I-Lun YANG ,  Hsuan LEE

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/67 ,  H01L21/673

Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.