-
公开(公告)号：US20230384211A1
公开(公告)日：2023-11-30
申请号：US18361777
申请日：2023-07-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Jen YANG , Chung-Pin CHOU , Yan-Cheng CHEN , Kai-Lin Chuang , Jun-Xiu Liu , Sheng-Ching Kao
CPC classification number: G01N21/05 , G01N21/9501 , G01N15/0211 , G01F1/663 , G01N2021/054 , G01N2015/1075
Abstract: A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.
-
公开(公告)号：US20230385502A1
公开(公告)日：2023-11-30
申请号：US18447170
申请日：2023-08-09
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chung-Pin CHOU , Chun-Wen WANG , Meng Ku CHI , Yan-Cheng CHEN , Jun-Xiu LIU
IPC: G06F30/367 , G06N20/00 , G06N5/04 , G06T7/70 , G06T7/00
CPC classification number: G06F30/367 , G06N20/00 , G06N5/04 , G06T7/70 , G06T7/001 , G06T2207/10061 , G06T2207/30148 , G06T2207/20081
Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.
-
公开(公告)号：US20210232745A1
公开(公告)日：2021-07-29
申请号：US17103772
申请日：2020-11-24
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chung-Pin CHOU , Chun-Wen WANG , Meng Ku CHI , Yan-Cheng CHEN , Jun-Xiu LIU
IPC: G06F30/367 , G06N20/00 , G06N5/04 , G06T7/00 , G06T7/70
Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.
-
公开(公告)号：US20230060183A1
公开(公告)日：2023-03-02
申请号：US17461715
申请日：2021-08-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Jen YANG , Chung-Pin CHOU , Kai-Lin CHUANG , Yan-Cheng CHEN , Sheng-Ching KAO , Jun-Xiu LIU
Abstract: A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.
-
-
-
Search Results
4
records
(took 0.017 seconds)
