公开(公告)号：US20230384211A1

公开(公告)日：2023-11-30

申请号：US18361777

申请日：2023-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Jen YANG ,  Chung-Pin CHOU ,  Yan-Cheng CHEN ,  Kai-Lin Chuang ,  Jun-Xiu Liu ,  Sheng-Ching Kao

IPC: G01N21/05 ,  G01N21/95 ,  G01N15/02 ,  G01F1/663

CPC classification number: G01N21/05 ,  G01N21/9501 ,  G01N15/0211 ,  G01F1/663 ,  G01N2021/054 ,  G01N2015/1075

Abstract: A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.

公开(公告)号：US11031266B2

公开(公告)日：2021-06-08

申请号：US16449156

申请日：2019-06-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chih-Hung Liao ,  Shiao-Ching Wu ,  Jun-Xiu Liu

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677

Abstract: A method includes disposing a wafer carrier onto a load port; detecting, by a first sensor in the wafer carrier, an elevation of a slot in the wafer carrier; adjusting an elevation of a wafer transferring device according to the detected elevation of the slot; and moving, at the adjusted elevation of the wafer transferring device, a wafer to the slot by the wafer transferring device.

公开(公告)号：US10755405B2

公开(公告)日：2020-08-25

申请号：US15919428

申请日：2018-03-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yen-Liang Chen ,  Jun-Xiu Liu

IPC: G06K9/00 ,  G06T7/00 ,  H01L21/66 ,  G01N21/956

Abstract: Methods and systems for diagnosing a semiconductor wafer are provided. A first raw image, a second raw image, and a third raw image of the semiconductor wafer are obtained by an inspection apparatus according to graphic data system (GDS) information regarding layout of a target die. A first image-based comparison is performed by a determining circuitry on the first, second, and third raw images, so as to provide a comparison result. The comparison result indicates whether an image difference is present between the first, second, and third raw images.

公开(公告)号：US11816411B2

公开(公告)日：2023-11-14

申请号：US17103772

申请日：2020-11-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Pin Chou ,  Chun-Wen Wang ,  Meng Ku Chi ,  Yan-Cheng Chen ,  Jun-Xiu Liu

IPC: G06F30/367 ,  G06N20/00 ,  G06N5/04 ,  G06T7/70 ,  G06T7/00

CPC classification number: G06F30/367 ,  G06N5/04 ,  G06N20/00 ,  G06T7/001 ,  G06T7/70 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.

公开(公告)号：US10825650B2

公开(公告)日：2020-11-03

申请号：US16430323

申请日：2019-06-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Pin Chou ,  Sheng-Wen Huang ,  Jun-Xiu Liu

IPC: H01J37/28 ,  H01J37/22 ,  G06N20/00 ,  H01J37/26 ,  H01J37/153

Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.

公开(公告)号：US10784114B2

公开(公告)日：2020-09-22

申请号：US16670107

申请日：2019-10-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Han-Wen Liao ,  Jun-Xiu Liu ,  Chun-Chih Lin

IPC: H01L21/306 ,  H01L21/76 ,  H01L21/67 ,  H01L21/66 ,  H01L21/762 ,  H01L21/3105 ,  H01L21/311

Abstract: Methods for enhancing a surface topography of a structure formed on a substrate are provided. In one example, the method includes performing a polishing process on a substrate having a shallow trench isolation structure and a diffusion region, performing a surface topography enhancing process to enlarge a defect in at least one of the shallow trench isolation structure and the diffusion region, inspecting at least one of the shallow trench isolation structure and the diffusion region to detect the enlarged defect, and adjusting a parameter of the polishing process in response to detecting the enlarged defect.

公开(公告)号：US11017522B2

公开(公告)日：2021-05-25

申请号：US16388435

申请日：2019-04-18

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chung-Pin Chou ,  In-Tsang Lin ,  Sheng-Wen Huang ,  Yu-Ting Wang ,  Jui-Kuo Lai ,  Hsin-Hui Chou ,  Jun-Xiu Liu ,  Tien-Wen Wang

IPC: G06T3/40 ,  G06K9/62 ,  H01L21/02 ,  H01L21/66 ,  G06T7/00

Abstract: A system includes an inspection device and an image processing unit. The inspection device is configured to scan a wafer to generate an inspected image. The image processing unit is configured to receive the inspected image, and is configured to analyze the inspected image by using at least one deep learning algorithm in order to determine whether there is any defect image shown in a region of interest in the inspected image. When there is at least one defect image shown in the region of interest in the inspected image, the inspection device is further configured to magnify the region of interest in the inspected image to generate a magnified inspected image for identification of defects.

公开(公告)号：US10269557B2

公开(公告)日：2019-04-23

申请号：US14918243

申请日：2015-10-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Wei-Chih Hsu ,  Kai-Lin Chuang ,  Yuan-Chi Chien ,  Jeng-Huei Yang ,  Jun-Xiu Liu

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/306 ,  H01L21/687 ,  B08B3/04 ,  B08B13/00 ,  B08B17/00

Abstract: An apparatus of processing a semiconductor substrate include a chuck, a holder, a liquid supplying system and a positive pressure unit. The chuck has a principal surface and at least a hole formed thereon. The holder is capable of holding a semiconductor substrate at a position above the principal surface. The liquid supplying system is configured to provide a liquid film onto the principal surface through the hole. The positive pressure unit is configured for providing a gas flow to a space over the chuck. A method of processing a semiconductor substrate is disclosed herein as well.

公开(公告)号：US12296428B2

公开(公告)日：2025-05-13

申请号：US16657161

申请日：2019-10-18

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yen-Liang Chen ,  Jun-Xiu Liu ,  Chia-Hsien Chou

IPC: B24B37/32 ,  B24B49/12 ,  H01L21/321

Abstract: A polish head of a chemical mechanical polishing system is provided. The polish head includes a carrier head, a membrane mounted to the carrier head, an inner retaining ring mounted to the carrier head and surrounding the membrane, an outer retaining ring mounted to the carrier head and surrounding the inner retaining ring, and an image capturing device. The outer retaining ring is spaced apart from the inner retaining ring. The image capturing device is mounted to the carrier head and between the inner retaining ring and the outer retaining ring.

公开(公告)号：US11424101B2

公开(公告)日：2022-08-23

申请号：US17069712

申请日：2020-10-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Pin Chou ,  Sheng-Wen Huang ,  Jun-Xiu Liu

IPC: H01J37/28 ,  H01J37/22 ,  G06N20/00 ,  H01J37/26 ,  H01J37/153

Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.