公开(公告)号：US11121093B2

公开(公告)日：2021-09-14

申请号：US16575761

申请日：2019-09-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yue-Lin Peng ,  Cheng-Yi Huang ,  Fu-Jen Li ,  Shou-Wen Kuo

IPC: H01L23/544 ,  H01L21/677 ,  H01L21/67 ,  H01L21/68

Abstract: A wafer includes a first face having a first center, and a second face having a second center. The first and second centers are each arranged on a central axis, which passes through the first face and the second face. The first face and the second face adjoin one another at a circumferential edge. An alignment notch is disposed along the circumferential edge, and extends inwardly from the circumferential edge by an alignment notch radial distance. The alignment notch radial distance is less than a wafer radius as measured from the first center to the circumferential edge. A die region includes an array of die arranged in rows and columns and is circumferentially bounded by a die-less region which is devoid of die. A first identification mark including a string of characters is disposed entirely in the die-less region to a first side of the alignment notch.

公开(公告)号：US20200013726A1

公开(公告)日：2020-01-09

申请号：US16575761

申请日：2019-09-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yue-Lin Peng ,  Cheng-Yi Huang ,  Fu-Jen Li ,  Shou-Wen Kuo

IPC: H01L23/544 ,  H01L21/677

Abstract: A wafer includes a first face having a first center, and a second face having a second center. The first and second centers are each arranged on a central axis, which passes through the first face and the second face. The first face and the second face adjoin one another at a circumferential edge. An alignment notch is disposed along the circumferential edge, and extends inwardly from the circumferential edge by an alignment notch radial distance. The alignment notch radial distance is less than a wafer radius as measured from the first center to the circumferential edge. A die region includes an array of die arranged in rows and columns and is circumferentially bounded by a die-less region which is devoid of die. A first identification mark including a string of characters is disposed entirely in the die-less region to a first side of the alignment notch.

公开(公告)号：US20190019760A1

公开(公告)日：2019-01-17

申请号：US15904657

申请日：2018-02-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yue-Lin Peng ,  Cheng-Yi Huang ,  Fu-Jen Li ,  Shou-Wen Kuo

IPC: H01L23/544 ,  H01L21/677

Abstract: A wafer includes a first face having a first center, and a second face having a second center. The first and second centers are each arranged on a central axis, which passes through the first face and the second face. The first face and the second face adjoin one another at a circumferential edge. An alignment notch is disposed along the circumferential edge, and extends inwardly from the circumferential edge by an alignment notch radial distance. The alignment notch radial distance is less than a wafer radius as measured from the first center to the circumferential edge. A die region includes an array of die arranged in rows and columns and is circumferentially bounded by a die-less region which is devoid of die. A first identification mark including a string of characters is disposed entirely in the die-less region to a first side of the alignment notch.