公开(公告)号：US20020063214A1

公开(公告)日：2002-05-30

申请号：US09725973

申请日：2000-11-29

Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.

Inventor： Yu-Kung Hsiao ,  Chih-Kung Chang ,  Fu-Tien Weng ,  Chung-Sheng Hsiung ,  Bii-Jung Chang ,  Kuo-Liang Lu

IPC: G01J005/20

CPC classification number: G01J5/08 ,  G01J5/024 ,  G01J5/0806 ,  G01J5/0862 ,  G01J5/0884 ,  H01L27/14621

Abstract: Within both a method for fabricating an optoelectronic microelectronic fabrication and the optoelectronic microelectronic fabrication fabricated in accord with the method for fabricating the optoelectronic microelectronic fabrication there is first provided a substrate having formed therein a minimum of one photoactive region which is sensitive to infrared radiation. There is also formed over the substrate and in registration with the minimum of one optically active region a minimum of one microlens layer. Similarly, there is also formed interposed between the substrate and the minimum of one microlens layer an infrared filter layer, wherein the infrared filter is not formed contacting the substrate. The method provides that the optoelectronic microelectronic fabrication is fabricated with enhanced optical sensitivity.

Abstract translation: 在制造光电子微电子制造的方法和根据制造光电微电子制造的方法制造的光电子微电子制造中，首先提供了在其中形成有至少一个对红外辐射敏感的光活性区的衬底。 还在衬底上形成最小的一个光学活性区域至少一个微透镜层。 类似地，还形成了介于基板和最小的一个微透镜层之间的红外滤光器层，其中红外滤光器不与基板接触。 该方法提供了光电微电子制造以增强的光学灵敏度制造。