公开(公告)号：US20030016137A1

公开(公告)日：2003-01-23

申请号：US09910634

申请日：2001-07-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Chieh Huang ,  Am-Ming Chiang

IPC: G08B021/00

CPC classification number: G08B21/20 ,  G08B5/36

Abstract: A pod for transporting a cassette of semiconductor wafers that is equipped with a cover latch indicator is described. The pod is constructed by a base, a cover, a latch means and an indicator means. The base is used to support the cassette positioned thereon, while the cover removably carries on the base for protectively covering the cassette to prevent contamination of the wafers. The latch means is carried on the base for latching the cover onto the base. The latch means may be actuatable from a latched position in which the cover is latched onto the base to a released position allowing removal of the cover from the base. The indicator means is coupled with the latch means for providing a visual indication of the condition of the latch means.

Abstract translation: 描述了一种用于运输配备有盖闩锁指示器的半导体晶片盒的盒。 吊舱由底座，盖，闩锁装置和指示装置构成。 基座用于支撑位于其上的盒，而盖可拆卸地承载在基座上，用于保护性地覆盖盒，以防止晶片的污染。 闩锁装置承载在基座上，用于将盖子锁定在基座上。 闩锁装置可以从锁定位置致动，其中盖被锁定到基座上到允许从基座移除盖的释放位置。 指示器装置与闩锁装置相耦合，用于提供闩锁装置的状态的可视指示。

公开(公告)号：US20040190108A1

公开(公告)日：2004-09-30

申请号：US10401942

申请日：2003-03-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chieh Yeh ,  Yuh-Hwa Chang ,  Ching-Heng Po ,  Hsin-Chieh Huang ,  Jiann-Tyng Tzeng

IPC: G02B026/00

CPC classification number: G02B26/0841

Abstract: A product comprising a micromirror comprising a reflective layer and a treatment layer overlying the reflective layer, and wherein the treatment layer comprises Ti.

Abstract translation: 一种包括微反射镜的产品，包括反射层和覆盖反射层的处理层，并且其中处理层包括Ti。

公开(公告)号：US20040082194A1

公开(公告)日：2004-04-29

申请号：US10283588

申请日：2002-10-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Yi Wang ,  Hsin-Chieh Huang

IPC: H01L021/31

CPC classification number: H01L21/31055 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02274 ,  H01L21/02282 ,  H01L21/316 ,  H01L21/31612 ,  H01L21/76828 ,  H01L21/76832 ,  H01L21/76835

Abstract: A method for coating a thick spin-on-glass layer on a semiconductor structure without cracking problems and with improved planarization is disclosed. In the method, a pre-processed semiconductor structure that has a plurality of metal lines on top is first provided. After a first conformal layer of silicon oxide is deposited on top to insulate the metal lines, a first and a second layer of SOG are coated on top to a total thickness of at least 2500 null. On top of the second SOG layers, is then deposited a second layer of silicon oxide by a plasma enhanced oxide deposition technique to a thickness of at least 1000 null. A third and a fourth SOG layer are then coated on top of the stress buffer layer to a total thickness of at least 2500 null.

Abstract translation: 公开了一种用于在半导体结构上涂覆厚的自旋玻璃层而不会出现开裂问题和改进的平坦化的方法。 在该方法中，首先提供在顶部具有多个金属线的预处理半导体结构。 在顶部沉积第一保形层氧化硅以使金属线绝缘之后，将第一和第二层SOG涂覆在顶部至至少的总厚度上。 然后，在第二SOG层的顶部，然后通过等离子体增强氧化物沉积技术将至少二氧化硅层沉积至至少一个厚度。 然后将第三和第四SOG层涂覆在应力缓冲层的顶部上至至少2500的总厚度。

公开(公告)号：US20030234208A1

公开(公告)日：2003-12-25

申请号：US10175611

申请日：2002-06-20

Applicant: Taiwan Semiconductor Manufacturing Co.. Ltd.

Inventor： Hsin-Chieh Huang

IPC: B65D085/00

CPC classification number: H01L21/67386 ,  B65D2201/00 ,  H01L21/67294

Abstract: A wafer pod or container fitted with at least one magnifying lens for magnifying the size of a lot number or other identifying indicia typically inscribed on a wafer inside the pod or container. The magnifying lens enables quick and accurate visual identification of the wafers by lot number or other identifying indicia as the wafers are transported in a semiconductor wafer fabrication facility.

Abstract translation: 装配有至少一个放大镜的晶片盒或容器，用于放大通常刻在荚果或容器内的晶片上的批号或其他识别标记的尺寸。 当晶片在半导体晶片制造设备中传输时，放大透镜可以通过批号或其他识别标记快速准确地对晶片进行视觉识别。