公开(公告)号：US20230369094A1

公开(公告)日：2023-11-16

申请号：US18358948

申请日：2023-07-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Cheng-Shiuan Wong ,  Chih-Chiang Tsao ,  Chao-Wei Chiu ,  Hao-Jan Pei ,  Wei-Yu Chen ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chia-Shen Cheng

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/687 ,  H01L21/56

CPC classification number: H01L21/6838 ,  H01L24/03 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/56 ,  H01L2224/0231 ,  H01L2224/02379

Abstract: A method of handling a workpiece includes the following steps. A workpiece is placed on a chuck body, wherein the workpiece includes a tape carrier extending beyond a periphery of the chuck body and a workpiece body disposed on the tape carrier, and the chuck body includes a seal ring surrounding the periphery of the chuck body; the tape carrier is clamped outside the chuck body, wherein the tape carrier leans against the seal ring and an enclosed space is formed between the chuck body, the tape carrier and the seal ring; and a vacuum seal is formed by evacuating gas from the enclosed space to pull the periphery of the workpiece toward the chuck body.

公开(公告)号：US20210225684A1

公开(公告)日：2021-07-22

申请号：US17010855

申请日：2020-09-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Cheng-Shiuan Wong ,  Chih-Chiang Tsao ,  Chao-Wei Chiu ,  Hao-Jan Pei ,  Wei-Yu Chen ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chia-Shen Cheng

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/56 ,  H01L23/00

Abstract: A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.

公开(公告)号：US20240203936A1

公开(公告)日：2024-06-20

申请号：US18592523

申请日：2024-03-01

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Mao-Yen Chang ,  Yu-Chia Lai ,  Cheng-Shiuan Wong ,  Ting Hao Kuo ,  Ching-Hua Hsieh ,  Hao-Yi Tsai ,  Kuo-Lung Pan ,  Hsiu-Jen Lin

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/544 ,  H01L23/58

CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/568 ,  H01L23/544 ,  H01L23/562 ,  H01L23/585 ,  H01L24/24 ,  H01L24/82 ,  H01L24/73 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24265 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/73217 ,  H01L2224/82005 ,  H01L2224/82947

Abstract: A semiconductor structure includes a functional die, a dummy die, a conductive feature, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The conductive feature is electrically connected to the functional die. The seal ring is disposed aside the conductive feature. The alignment mark is disposed between the seal ring and the conductive feature, and the alignment mark is electrically isolated from the dummy die, the conductive feature and the seal ring.

公开(公告)号：US20240088062A1

公开(公告)日：2024-03-14

申请号：US18518456

申请日：2023-11-23

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hao-Jan Pei ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Jen-Jui Yu ,  Cheng-Shiuan Wong

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49822

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

公开(公告)号：US11791192B2

公开(公告)日：2023-10-17

申请号：US17010855

申请日：2020-09-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Cheng-Shiuan Wong ,  Chih-Chiang Tsao ,  Chao-Wei Chiu ,  Hao-Jan Pei ,  Wei-Yu Chen ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chia-Shen Cheng

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L21/6838 ,  H01L21/56 ,  H01L21/6836 ,  H01L21/68721 ,  H01L24/03 ,  H01L2224/0231 ,  H01L2224/02379

Abstract: A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.

公开(公告)号：US11610859B2

公开(公告)日：2023-03-21

申请号：US17080842

申请日：2020-10-27

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Cheng-Shiuan Wong ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Hsuan-Ting Kuo ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Philip Yu-Shuan Chung

IPC: B23K1/00 ,  B23K3/00 ,  H01L23/00 ,  B23K1/008 ,  B23K101/40

Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

公开(公告)号：US20230068263A1

公开(公告)日：2023-03-02

申请号：US17460319

申请日：2021-08-30

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Mao-Yen Chang ,  Yu-Chia Lai ,  Cheng-Shiuan Wong ,  Ting Hao Kuo ,  Ching-Hua Hsieh ,  Hao-Yi Tsai ,  Kuo-Lung Pan ,  Hsiu-Jen Lin

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/58 ,  H01L23/544

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

公开(公告)号：US12176319B2

公开(公告)日：2024-12-24

申请号：US18172988

申请日：2023-02-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Cheng-Shiuan Wong ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Hsuan-Ting Kuo ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Philip Yu-Shuan Chung

IPC: B23K1/00 ,  B23K1/008 ,  H01L23/00 ,  B23K101/40

Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

公开(公告)号：US11862577B2

公开(公告)日：2024-01-02

申请号：US17561744

申请日：2021-12-24

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hao-Jan Pei ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Jen-Jui Yu ,  Cheng-Shiuan Wong

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49822

Abstract: Provided is a package structure, including a die, a plurality of through vias, an encapsulant, a plurality of first connectors, a warpage control material and a protection material. The plurality of through vias are disposed around the die. The encapsulant laterally encapsulate the die and the plurality of through vias. The plurality of first connectors are electrically connected to a first surface of the plurality of through vias. The warpage control material is disposed over a first surface of the die. The protection material is disposed over the encapsulant, around the plurality of first connectors and the warpage control material. A Young's modulus of the warpage control material is greater than a Young's modulus of the encapsulant, and the Young's modulus of the encapsulant is greater than a Young's modulus of the protection material.

公开(公告)号：US20220130795A1

公开(公告)日：2022-04-28

申请号：US17080842

申请日：2020-10-27

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Cheng-Shiuan Wong ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Hsuan-Ting Kuo ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Philip Yu-Shuan Chung

IPC: H01L23/00 ,  B23K1/008

Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.