公开(公告)号：US11742320B2

公开(公告)日：2023-08-29

申请号：US17249758

申请日：2021-03-11

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsi-Cheng Hsu ,  Jui-Chun Weng ,  Ching-Hsiang Hu ,  Ji-Hong Chiang ,  Kuo-Hao Lee ,  Chia-Yu Lin ,  Chia-Chun Hung ,  Yen-Chieh Tu ,  Chien-Tai Su ,  Hsin-Yu Chen

IPC分类号： H01L23/00 ,  H01L23/544 ,  H01L25/065

CPC分类号： H01L24/94 ,  H01L23/544 ,  H01L23/562 ,  H01L24/32 ,  H01L25/0657

摘要： Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, where the scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates to compensate for differences in the thermal expansion rates of the substrates. The devices on the substrates are brought into alignment as the substrates are heated during a bonding operation due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis of the substrate or may be arranged in a plurality of directions to compensate for actinomorphic thermal expansion.