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公开(公告)号：US11415878B2
公开(公告)日：2022-08-16
申请号：US17021778
申请日：2020-09-15
发明人： Kuo-Hao Lee , You-Cheng Jhang , Han-Zong Pan , Jui-Chun Weng , Chiu-Hua Chung , Sheng-Yuan Lin , Hsin-Yu Chen
摘要： A photomask assembly may be formed such that stress relief trenches are formed in a pellicle frame of the photomask assembly. The stress relief trenches may reduce or prevent damage to a pellicle that may otherwise result from deformation of the pellicle. The stress relief trenches may be formed in areas of the pellicle frame to allow the pellicle frame to deform with the pellicle, thereby reducing the amount damage to the pellicle caused by the pellicle frame.
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公开(公告)号：US09880192B2
公开(公告)日：2018-01-30
申请号：US14609234
申请日：2015-01-29
发明人： Shyh-Wei Cheng , Yu-Ting Hsu , Hsi-Cheng Hsu , Chih-Yu Wang , Jui-Chun Weng , Che-Jung Chu
IPC分类号： H01R31/00 , G01P15/125 , H01G5/16 , G01P15/08
CPC分类号： G01P15/125 , G01P2015/0871 , H01G5/16 , Y10T29/43
摘要： A Micro-Electro-Mechanical System (MEMS) device includes a sensing element, and a proof mass over and overlapping at least a portion of the sensing element. The proof mass is configured to be movable toward the sensing element. A protection region is formed between the sensing element and the proof mass. The protection region overlaps a first portion of the sensing element, and does not overlap a second portion of the sensing element, wherein the first and the second portions overlap the proof mass.
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公开(公告)号：US08916943B2
公开(公告)日：2014-12-23
申请号：US13782051
申请日：2013-03-01
发明人： Shyh-Wei Cheng , Jui-Chun Weng , Hsi-Cheng Hsu , Chih-Yu Wang , Jung-Kuo Tu , Che-Jung Chu , Yu-Ting Hsu
CPC分类号： B81C1/00277 , B81B7/0041 , B81B7/02 , B81C1/0023 , B81C1/00269 , B81C1/00285 , B81C1/00293 , B81C3/001 , B81C2203/0118
摘要： An integrated circuit device includes a first layer comprising at least two partial cavities, an intermediate layer bonded to the first layer, the intermediate layer formed to support at least two Micro-electromechanical System (MEMS) devices, and a second layer bonded to the intermediate layer, the second layer comprising at least two partial cavities to complete the at least two partial cavities of the first layer through the intermediate layer to form at least two sealed full cavities. The at least two full cavities have different pressures within.
摘要翻译： 一种集成电路器件包括：第一层，其包括至少两个部分空穴，中间层与第一层结合，形成以支持至少两个微机电系统（MEMS）器件的中间层，以及与中间体结合的第二层 层，所述第二层包括至少两个部分空腔，以通过所述中间层完成所述第一层的所述至少两个部分空腔，以形成至少两个密封的完整空腔。 至少两个完整的腔体内部具有不同的压力。
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公开(公告)号：US12054382B2
公开(公告)日：2024-08-06
申请号：US18308950
申请日：2023-04-28
发明人： Hsi-Cheng Hsu , Kuo-Hao Lee , Jui-Chun Weng , Ching-Hsiang Hu , Ji-Hong Chiang , Lavanya Sanagavarapu , Chia-Yu Lin , Chia-Chun Hung , Jia-Syuan Li , Yu-Pei Chiang
CPC分类号： B81B3/0005 , B81C1/00968 , B81C2201/112 , B81C2201/115
摘要： A micro-electromechanical-system (MEMS) device may be formed to include an anti-stiction polysilicon layer on one or more moveable MEMS structures of a device wafer of the MEMS device to reduce, minimize, and/or eliminate stiction between the moveable MEMS structures and other components or structures of the MEMS device. The anti-stiction polysilicon layer may be formed such that a surface roughness of the anti-stiction polysilicon layer is greater than the surface roughness of a bonding polysilicon layer on the surfaces of the device wafer that are to be bonded to a circuitry wafer of the MEMS device. The higher surface roughness of the anti-stiction polysilicon layer may reduce the surface area of the bottom of the moveable MEMS structures, which may reduce the likelihood that the one or more moveable MEMS structures will become stuck to the other components or structures.
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公开(公告)号：US20220348454A1
公开(公告)日：2022-11-03
申请号：US17852750
申请日：2022-06-29
发明人： Shyh-Wei Cheng , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Shiuan-Jeng Lin , Wei-Ding Wu , Ching-Hsiang Hu
摘要： The present disclosure relates to a micro-electromechanical system (MEMS) structure including one or more semiconductor devices arranged on or within a first substrate and a MEMS substrate having an ambulatory element. The MEMS substrate is connected to the first substrate by a conductive bonding structure. A capping substrate is arranged on the MEMs substrate. The capping substrate includes a semiconductor material that is separated from the first substrate by the MEMS substrate. One or more conductive polysilicon vias include a polysilicon material that continuously extends from the conductive bonding structure, completely through the MEMS substrate, and to within the capping substrate. The semiconductor material of the capping substrate covers opposing sidewalls of the polysilicon material and an upper surface of the polysilicon material that is between the opposing sidewalls.
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公开(公告)号：US11655138B2
公开(公告)日：2023-05-23
申请号：US17302484
申请日：2021-05-04
发明人： Hsi-Cheng Hsu , Kuo-Hao Lee , Jui-Chun Weng , Ching-Hsiang Hu , Ji-Hong Chiang , Lavanya Sanagavarapu , Chia-Yu Lin , Chia-Chun Hung , Jia-Syuan Li , Yu-Pei Chiang
CPC分类号： B81B3/0005 , B81C1/00968 , B81C2201/112 , B81C2201/115
摘要： A micro-electromechanical-system (MEMS) device may be formed to include an anti-stiction polysilicon layer on one or more moveable MEMS structures of a device wafer of the MEMS device to reduce, minimize, and/or eliminate stiction between the moveable MEMS structures and other components or structures of the MEMS device. The anti-stiction polysilicon layer may be formed such that a surface roughness of the anti-stiction polysilicon layer is greater than the surface roughness of a bonding polysilicon layer on the surfaces of the device wafer that are to be bonded to a circuitry wafer of the MEMS device. The higher surface roughness of the anti-stiction polysilicon layer may reduce the surface area of the bottom of the moveable MEMS structures, which may reduce the likelihood that the one or more moveable MEMS structures will become stuck to the other components or structures.
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公开(公告)号：US09561954B2
公开(公告)日：2017-02-07
申请号：US14577628
申请日：2014-12-19
发明人： Shyh-Wei Cheng , Jui-Chun Weng , Hsi-Cheng Hsu , Chih-Yu Wang , Jung-Kuo Tu , Che-Jung Chu , Yu-Ting Hsu
CPC分类号： B81C1/00277 , B81B7/0041 , B81B7/02 , B81C1/0023 , B81C1/00269 , B81C1/00285 , B81C1/00293 , B81C3/001 , B81C2203/0118
摘要： A method for forming an integrated circuit having Micro-electromechanical Systems (MEMS) includes forming at least two recesses into a first layer, forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the recesses of the first layer. An intermediate layer is bonded onto the second layer, the intermediate layer includes through-holes corresponding to the recesses of the second layer. The first layer is bonded to the intermediate layer such that cavities are formed, the cavities to act as operating environments for MEMS devices. The two cavities have different pressures.
摘要翻译： 一种用于形成具有微机电系统（MEMS）的集成电路的方法包括：将至少两个凹陷形成到第一层中，将至少两个凹陷形成第二层，所述第二层的至少两个凹槽与凹部互补 的第一层。 中间层结合到第二层上，中间层包括对应于第二层的凹部的通孔。 第一层被结合到中间层，使得形成空腔，空腔用作MEMS器件的操作环境。 两个腔体具有不同的压力。
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公开(公告)号：US11789360B2
公开(公告)日：2023-10-17
申请号：US17813165
申请日：2022-07-18
发明人： Kuo-Hao Lee , Hsi-Cheng Hsu , Jui-Chun Weng , Han-Zong Pan , Hsin-Yu Chen , You-Cheng Jhang
摘要： A portion of a buffer layer on a backside of a substrate of a photomask assembly may be removed prior to formation of one or more capping layers on the backside of the substrate. The one or more capping layers may be formed directly on the backside of the substrate where the buffer layer is removed from the substrate, and a hard mask layer may be formed directly on the one or more capping layers. The one or more capping layers may include a low-stress material to promote adhesion between the one or more capping layers and the substrate, and to reduce and/or minimize peeling and delamination of the capping layer(s) from the substrate. This may reduce the likelihood of damage to the pellicle layer and/or other components of the photomask assembly and/or may increase the yield of an exposure process in which the photomask assembly is used.
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公开(公告)号：US11742320B2
公开(公告)日：2023-08-29
申请号：US17249758
申请日：2021-03-11
发明人： Hsi-Cheng Hsu , Jui-Chun Weng , Ching-Hsiang Hu , Ji-Hong Chiang , Kuo-Hao Lee , Chia-Yu Lin , Chia-Chun Hung , Yen-Chieh Tu , Chien-Tai Su , Hsin-Yu Chen
IPC分类号： H01L23/00 , H01L23/544 , H01L25/065
CPC分类号： H01L24/94 , H01L23/544 , H01L23/562 , H01L24/32 , H01L25/0657
摘要： Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, where the scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates to compensate for differences in the thermal expansion rates of the substrates. The devices on the substrates are brought into alignment as the substrates are heated during a bonding operation due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis of the substrate or may be arranged in a plurality of directions to compensate for actinomorphic thermal expansion.
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公开(公告)号：US20150177273A1
公开(公告)日：2015-06-25
申请号：US14609234
申请日：2015-01-29
发明人： Shyh-Wei Cheng , Yu-Ting Hsu , Hsi-Cheng Hsu , Chih-Yu Wang , Jui-Chun Weng , Che-Jung Chu
IPC分类号： G01P15/125 , H01G5/16
CPC分类号： G01P15/125 , G01P2015/0871 , H01G5/16 , Y10T29/43
摘要： A Micro-Electro-Mechanical System (MEMS) device includes a sensing element, and a proof mass over and overlapping at least a portion of the sensing element. The proof mass is configured to be movable toward the sensing element. A protection region is formed between the sensing element and the proof mass. The protection region overlaps a first portion of the sensing element, and does not overlap a second portion of the sensing element, wherein the first and the second portions overlap the proof mass.
摘要翻译： 微电子机械系统（MEMS）装置包括感测元件，以及在感测元件的至少一部分上方并且重叠的质量块。 检测质量被配置为可朝向感测元件移动。 在感测元件和检测质量块之间形成保护区域。 保护区域与感测元件的第一部分重叠，并且不与感测元件的第二部分重叠，其中第一和第二部分与证明块重叠。
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