公开(公告)号：US20210384152A1

公开(公告)日：2021-12-09

申请号：US17409138

申请日：2021-08-23

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-En YEN ,  Chin-Wei KANG ,  Kai-Jun ZHAN ,  Wen-Hsiung LU ,  Cheng-Jen LIN ,  Ming-Da CHENG ,  Mirng-Ji LII

IPC分类号： H01L23/00

摘要： A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.