公开(公告)号：US20210265289A1

公开(公告)日：2021-08-26

申请号：US17315921

申请日：2021-05-10

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yung-Ping CHIANG ,  Yi-Che CHIANG ,  Nien-Fang WU ,  Min-Chien HSIAO ,  Chao-Wen SHIH ,  Shou-Zen CHANG ,  Chung-Shi LIU ,  Chen-Hua YU

IPC分类号： H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L21/683 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q21/00

摘要： Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and an antenna element over the semiconductor die. The chip package also includes a first conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element. The chip package further includes a protective layer surrounding the first conductive feature. In addition, the chip package includes a second conductive feature over the first conductive feature. A portion of the second conductive feature is between the first conductive feature and the protective layer.

公开(公告)号：US20230317645A1

公开(公告)日：2023-10-05

申请号：US18328915

申请日：2023-06-05

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yung-Ping CHIANG ,  Yi-Che CHIANG ,  Nien-Fang WU ,  Min-Chien HSIAO ,  Chao-Wen SHIH ,  Shou-Zen CHANG ,  Chung-Shi LIU ,  Chen-Hua YU

IPC分类号： H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L21/683 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q21/00

CPC分类号： H01L23/66 ,  H01L24/32 ,  H01L24/24 ,  H01L23/552 ,  H01L24/25 ,  H01L24/02 ,  H01L24/13 ,  H01L23/3121 ,  H01L25/0655 ,  H01L24/19 ,  H01L21/6835 ,  H01Q9/045 ,  H01Q21/065 ,  H01Q21/0087 ,  H01L21/568

摘要： A package structure is provided. The package structure includes a dielectric structure and an antenna structure disposed in the dielectric structure. The package structure also includes a semiconductor device disposed on the dielectric structure and a protective layer surrounding the semiconductor device. The package structure further includes a conductive feature electrically connecting the semiconductor device and the antenna structure. A portion of the antenna structure is between the conductive feature and the dielectric structure.