公开(公告)号：US20140285213A1

公开(公告)日：2014-09-25

申请号：US14217002

申请日：2014-03-17

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Shigeo SAKURAI ,  Tetsuo SAJI

IPC: G01R31/04 ,  H05K1/18 ,  H05K1/02 ,  G01R31/02

CPC classification number: G01R31/048 ,  G01R27/26 ,  G01R31/028 ,  G01R31/2812 ,  G01R31/2813 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: In a component-embedded circuit substrate having a plurality of capacitors embedded therein, the capacitors are connected in parallel, inspection electrodes are formed, and the inspection electrodes connect to respective terminal electrodes of the capacitor through via conductors. At the terminal electrodes of the capacitor, the connection position of the via conductors for connecting the inspection electrodes differs from the connection position of via conductors for connecting respective terminal electrodes of the capacitor.

Abstract translation: 在嵌入有多个电容器的分量嵌入式电路基板中，并联连接电容器，形成检查电极，检查电极通过通孔导体与电容器的各个端子电极连接。 在电容器的端子电极上，用于连接检查电极的通路导体的连接位置与用于连接电容器的各个端子电极的通路导体的连接位置不同。