公开(公告)号：US20200027836A1

公开(公告)日：2020-01-23

申请号：US16515625

申请日：2019-07-18

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Takayuki TAKANO ,  Yuichi SASAJIMA

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/31

Abstract: A semiconductor module includes: a base substrate that includes a first dielectric film and an electrode layer, the first dielectric film having a mounting surface, the mounting surface including a first mounting area and a second mounting area; a first semiconductor part mounted on the first mounting area; and a second semiconductor part mounted on the second mounting area, the second semiconductor part including a vertical power semiconductor device, a conductive block to be connected to the electrode layer, and a wiring substrate, the vertical power semiconductor device having a first surface and a second surface, the first surface including a first terminal to be connected to the electrode layer, the second surface including a second terminal, the wiring substrate electrically connecting the conductive block and the second terminal.

公开(公告)号：US20200006238A1

公开(公告)日：2020-01-02

申请号：US16456398

申请日：2019-06-28

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Hideki YOKOTA ,  Yuichi SASAJIMA

IPC: H01L23/538 ,  H01L23/31

Abstract: A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface, the first surface including a first mounting area and a second mounting area, the second surface including a first area and a second area, the first area facing the first mounting area, the second area facing the second mounting area; a plurality of circuit parts that includes a first circuit part and a second circuit part, the first circuit part being mounted on the first mounting area, the second circuit part being mounted on the second mounting area; a sealing layer that is provided on the first surface and covers the plurality of circuit parts; and an electrode layer that includes a first electrode group and a second electric group, the first electrode group including a plurality of first electrode terminals that covers substantially the entire area of the first area and is to be electrically connected to the first circuit part, the second electrode group including a plurality of second electrode terminals that covers substantially an entire area of the second area and is to be electrically connected to the second circuit part.

公开(公告)号：US20200006170A1

公开(公告)日：2020-01-02

申请号：US16456342

申请日：2019-06-28

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Takashi NUNOKAWA ,  Yuichi SASAJIMA ,  Takayuki TAKANO

IPC: H01L23/18 ,  H01L25/18 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface; a plurality of circuit parts mounted on the first surface; an electrode layer that is disposed on the second surface and includes a plurality of electrode portions to be electrically connected to the plurality of circuit parts, at least a part of the plurality of electrode portions including a base that is long in one axis direction; a rigid member that is disposed on the first surface, includes, at least one shaft portion, and faces the base with the dielectric layer sandwiched therebetween, the at least one shaft axis extending along the one axis direction; and a sealing layer that is provided on the first surface and covers the plurality of circuit parts and the rigid member.

公开(公告)号：US20130271238A1

公开(公告)日：2013-10-17

申请号：US13790989

申请日：2013-03-08

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yosuke ONDA ,  Taisei IRIEDA ,  Tomoyuki TAKAHASHI ,  Yuichi SASAJIMA

IPC: H03H9/70 ,  H03H9/64 ,  H03H9/54

CPC classification number: H03H9/54 ,  H03H9/02228 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/706 ,  H03H9/725

Abstract: A transmitting/receiving filter (filter device) according to one embodiment of the present invention is provided with a transmitting filter, a receiving filter, and a support substrate. The transmitting filter includes a first resonator constituted of a BAW device (FBAR, SMR). The receiving filter includes a second resonator constituted of a Lamb wave device. The support substrate supports both the transmitting filter and the receiving filter. The transmitting filter and the receiving filter are constituted of elastic wave resonators that resonate at different oscillation modes from each other, which allows miniaturization of the support substrate to be realized while preventing oscillation interference between the two filters.

Abstract translation: 根据本发明的一个实施例的发射/接收滤波器（滤波器装置）设置有发射滤波器，接收滤波器和支撑基板。 发射滤波器包括由BAW装置（FBAR，SMR）构成的第一谐振器。 接收滤波器包括由兰姆波器件构成的第二谐振器。 支撑基板支撑发射滤波器和接收滤波器。 发送滤波器和接收滤波器由以不同的振荡模式彼此谐振的弹性波谐振器构成，这允许在防止两个滤波器之间的振荡干扰的同时实现支撑基板的小型化。