公开(公告)号：US20110214135A1

公开(公告)日：2011-09-01

申请号：US13126813

申请日：2008-10-31

申请人： Takashi Furusho ,  Takashi Kobayashi ,  Kenji Hino ,  Tetsuya Uchiyama ,  Yoshitaka Ono

发明人： Takashi Furusho ,  Takashi Kobayashi ,  Kenji Hino ,  Tetsuya Uchiyama ,  Yoshitaka Ono

IPC分类号： G11B17/051

CPC分类号： G11B17/0404 ,  G11B17/051

摘要： There is provided a data processing device able to surely eject a recording medium out of a main body of the device even when the recording medium is received in a case while a locking member having adherence and elasticity of the case is locked with a center hole of the recording medium.A CD player includes: a main body of the device 3; a carrying unit 5 for ejecting and retracting a CD 2 from the main body of the device 3; a clamping and reading out unit 6 for reading out data recorded on the CD 2; and a microcomputer 4. The carrying unit 5 includes: a disc guide 17; and a roller arm 18 having a carrying roller 20. The microcomputer 4 makes the turntable 26 of the clamping and reading out unit 6 rotate while the CD 2 is held between the disc guide 17 and the carrying roller 20 when the carrying unit 5 fails to eject the CD 2 out of the main body of the device 3.

摘要翻译： 提供了一种数据处理装置，即使在壳体的附着力和弹性的锁定构件被锁定的情况下，即使在记录介质被接收的情况下，也可以将记录介质确定地从设备的主体排出， 记录介质。 CD播放器包括：设备3的主体; 用于从设备3的主体弹出和缩回CD2的传送单元5; 用于读出记录在CD2上的数据的夹持和读出单元6; 和微型计算机4.承载单元5包括：盘导向件17; 以及具有承载辊20的辊臂18.微型计算机4使得夹持和读出单元6的转台26旋转，同时当携带单元5不能使CD 2保持在盘导向件17和承载辊20之间时 将CD 2从设备3的主体中弹出。

公开(公告)号：US20070132110A1

公开(公告)日：2007-06-14

申请号：US11451372

申请日：2006-06-13

申请人： Koichi Fujita ,  Yoji Maruyama ,  Kenji Hino

发明人： Koichi Fujita ,  Yoji Maruyama ,  Kenji Hino

IPC分类号： H01L23/28

CPC分类号： H01L23/3135 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/01078 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A semiconductor device having a molded package includes a semiconductor chip, a thick-film lead electrode to which the semiconductor chip is die-bonded, a thin-film lead electrode having a thickness smaller than that of the thick-film lead electrode, a wire which electrically connects the semiconductor chip to the thin-film lead wire, and a molding material in which the semiconductor chip and the wire are encapsulated. A portion of a lower surface of the thick-film lead electrode is exposed at a package lower surface as a heat dissipating electrode. A portion of an upper surface of the thin-film lead electrode is exposed at a package upper surface as an input/output electrode. A portion of an upper surface of the thick-film lead electrode is exposed at the package upper surface as a grounding electrode.

摘要翻译： 具有模制封装的半导体器件包括：半导体芯片，半导体芯片被芯片焊接的厚膜引线电极，具有比厚膜引线电极的厚度小的薄膜引线电极， 其将半导体芯片电连接到薄膜引线，以及其中封装有半导体芯片和导线的成型材料。 厚膜引线电极的下表面的一部分作为散热电极在封装下表面露出。 薄膜引线电极的上表面的一部分作为输入/输出电极在封装上表面露出。 厚膜引线电极的上表面的一部分作为接地电极在封装上表面露出。

公开(公告)号：US08569871B2

公开(公告)日：2013-10-29

申请号：US11451372

申请日：2006-06-13

申请人： Koichi Fujita ,  Yoji Maruyama ,  Kenji Hino

发明人： Koichi Fujita ,  Yoji Maruyama ,  Kenji Hino

IPC分类号： H01L23/495

CPC分类号： H01L23/3135 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/01078 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A semiconductor device having a molded package includes a semiconductor chip, a thick-film lead electrode to which the semiconductor chip is die-bonded, a thin-film lead electrode having a thickness smaller than that of the thick-film lead electrode, a wire which electrically connects the semiconductor chip to the thin-film lead wire, and a molding material in which the semiconductor chip and the wire are encapsulated. A portion of a lower surface of the thick-film lead electrode is exposed at a package lower surface as a heat dissipating electrode. A portion of an upper surface of the thin-film lead electrode is exposed at a package upper surface as an input/output electrode. A portion of an upper surface of the thick-film lead electrode is exposed at the package upper surface as a grounding electrode.

摘要翻译： 具有模制封装的半导体器件包括：半导体芯片，半导体芯片被芯片焊接的厚膜引线电极，具有比厚膜引线电极的厚度小的薄膜引线电极， 其将半导体芯片电连接到薄膜引线，以及其中封装有半导体芯片和导线的成型材料。 厚膜引线电极的下表面的一部分作为散热电极在封装下表面露出。 薄膜引线电极的上表面的一部分作为输入/输出电极在封装上表面露出。 厚膜引线电极的上表面的一部分作为接地电极在封装上表面露出。

公开(公告)号：US07185347B2

公开(公告)日：2007-02-27

申请号：US10822792

申请日：2004-04-13

申请人： Kenji Hino

发明人： Kenji Hino

IPC分类号： G11B33/02

CPC分类号： G11B17/0404

摘要： A shutter device includes a shutter member which rotates about a first rotational axis and a swinging arm for the shutter member by engaging the shutter member. The shutter member has an insertion preventing portion which, by being rotated by the swinging arm rotating about a second rotational axis, is positioned at a preventing position for preventing the insertion of a recording medium by covering at least a portion of an opening for inserting the recording medium and at an open position enabling the insertion and ejection of the recording medium by opening the opening. Engaging portions of the shutter member and the swinging arm are provided between the first rotational axis and the position of the insertion preventing portion in the shutter member.

摘要翻译： 快门装置包括通过接合快门部件围绕第一旋转轴线旋转的活门部件和用于活门部件的摆动臂。 挡板部件具有插入防止部，该插入防止部通过围绕第二旋转轴线旋转的摆动臂旋转，位于防止位置，以防止通过覆盖用于插入的开口的至少一部分而插入记录介质 记录介质，并且处于打开位置，能够通过打开开口插入和排出记录介质。 活门构件和摆动臂的接合部分设置在第一旋转轴线与挡板构件中插入防止部分的位置之间。