摘要:
In a nest MZI modulator in which each arm includes a child MZI, the power consumption is reduced. The hybrid integrated-type nest MZI modulator of the embodiment 1a is configured so that, instead of placing a relative phase adjusting section in a parent MZI, a bias electrode Bias 90° in which an electric field is applied in the same direction to the polarization direction in both of the upper and lower arms is placed in each child MZI (see FIG. 4B). The bias electrode Bias 90° provided in each child MZI constitute the entirety of a relative phase adjusting section. The optical signals are subjected to a phase change after the output from the child MZI (see FIG. 1A), because such relative phase adjusting section can subject the optical signals of the upper and lower arms of the child MZI to a shift change in the same direction, respectively.
摘要:
In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (300) comprises an optical device chip (310) including an LN waveguide (311), a first PLC waveguide (312), a second PLC waveguide (313), and a fiber alignment member (314), a mount (320), and optical fibers (330). Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as an tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.
摘要:
In an optical component configured to fix to a mount an optical device chip in which a plurality of waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (300) comprises an optical device chip (310) including an LN waveguide (311), a first PLC waveguide (312) connected to an end of the LN waveguide (311), a second PLC waveguide (313) connected to the other end of the LN waveguide (311), and a fiber alignment member (314) connected to the first PLC waveguide (312), a mount (320) on which the optical device chip (310) is mounted, and optical fibers (330) aligned to the fiber alignment member (314). Each of connection faces between the first PLC waveguide (312) and the fiber alignment member (314) is configured as an tilted structure, and each of connection faces between the LN waveguide (311), and the first and second PLC waveguides (312, 313) is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.
摘要:
Disclosed is an optical modulator which substantially lowers loss and has little attenuation in the intensity of an optical signal after modulation. The optical modulator includes a 1×2 RZ pulse carver wherein optical phase shifters used for modulation are arranged along two arm waveguides held between a 1×2 coupler and a 2×2 coupler, two interferometric modulators connected respectively to two output ports of the 2×2 coupler, and a 2×1 coupler for combining the outputs of the interferometric modulators.
摘要:
Disclosed is an optical modulator which substantially lowers loss and has little attenuation in the intensity of an optical signal after modulation. The optical modulator includes a 1×2 RZ pulse carver wherein optical phase shifters used for modulation are arranged along two arm waveguides held between a 1×2 coupler and a 2×2 coupler, two interferometric modulators connected respectively to two output ports of the 2×2 coupler, and a 2×1 coupler for combining the outputs of the interferometric modulators.
摘要:
In a nest MZI modulator in which each arm includes a child MZI, the power consumption is reduced. The hybrid integrated-type nest MZI modulator of the embodiment 1a is configured so that, instead of placing a relative phase adjusting section in a parent MZI, a bias electrode Bias 90° in which an electric field is applied in the same direction to the polarization direction in both of the upper and lower arms is placed in each child MZI (see FIG. 4B). The bias electrode Bias 90° provided in each child MZI constitute the entirety of a relative phase adjusting section. The optical signals are subjected to a phase change after the output from the child MZI (see FIG. 1A), because such relative phase adjusting section can subject the optical signals of the upper and lower arms of the child MZI to a shift change in the same direction, respectively.
摘要:
An optical modulator having a high stability is provided. In the optical modulator according to the present invention, a phase modulation by an electro-optic effect is made on an optical substrate of an electro-optic material while the setting of an operating point by a thermal-optic effect is made on a planar lightwave circuit (PLC) substrate of quartz, silicon, or the like. Such configuration can suppress the influence of thermal drift or the like because no heat is applied directly to the optical substrate of the electro-optic material. In addition, breakage and warpage of the substrate due to heat are also mitigated. Further, quartz used for the PLC has a low thermal conductivity, approximately one-fifth of that of the LN substrate (approximately 1 W/(m·K)), and therefore, a desired phase difference can be maintained with a low power consumption, and thus, the operating point becomes stabilized.
摘要:
An optical modulator having a high stability is provided. In the optical modulator according to the present invention, a phase modulation by an electro-optic effect is made on an optical substrate of an electro-optic material while the setting of an operating point by a thermal-optic effect is made on a planar lightwave circuit (PLC) substrate of quartz, silicon, or the like. Such configuration can suppress the influence of thermal drift or the like because no heat is applied directly to the optical substrate of the electro-optic material. In addition, breakage and warpage of the substrate due to heat are also mitigated. Further, quartz used for the PLC has a low thermal conductivity, approximately one-fifth of that of the LN substrate (approximately 1 W/(m·K)), and therefore, a desired phase difference can be maintained with a low power consumption, and thus, the operating point becomes stabilized.
摘要:
An optical module controls its output characteristics electrically and an optical switch constitutes the optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be molded afterward. Wiring of the IC is grouped and integrated on the PLC substrate to achieve higher density and miniaturization of the optical module.
摘要:
An optical module controls its output characteristics electrically and an optical switch constitutes the optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be molded afterward. Wiring of the IC is grouped and integrated on the PLC substrate to achieve higher density and miniaturization of the optical module.