摘要:
A semiconductor storage device includes a semiconductor substrate, a first insulator, a laminated insulator including a second insulator having fixed charges more than those of the first insulator, a single-layer insulator, memory cells between the semiconductor substrate and the first insulator, each memory cells separated from an adjacent memory cell by a cavity portion and including a tunnel insulator, a charge accumulation layer, an insulator, and a control gate electrode, a first selection gate transistor between the semiconductor substrate and the first insulator, a second selection gate transistor between the semiconductor substrate and the first insulator, between one memory cell and the first selection gate transistor, and in contact with the laminated insulator on a first side face on a memory cell side thereof, and a high-voltage peripheral circuit transistor between the semiconductor substrate and the first insulator, and in contact with the single-layer insulator on a side face thereof.
摘要:
A semiconductor storage device includes a semiconductor substrate, a first insulator, a laminated insulator including a second insulator having fixed charges more than those of the first insulator, a single-layer insulator, memory cells between the semiconductor substrate and the first insulator, each memory cells separated from an adjacent memory cell by a cavity portion and including a tunnel insulator, a charge accumulation layer, an insulator, and a control gate electrode, a first selection gate transistor between the semiconductor substrate and the first insulator, a second selection gate transistor between the semiconductor substrate and the first insulator, between one memory cell and the first selection gate transistor, and in contact with the laminated insulator on a first side face on a memory cell side thereof, and a high-voltage peripheral circuit transistor between the semiconductor substrate and the first insulator, and in contact with the single-layer insulator on a side face thereof.
摘要:
A semiconductor memory device has a semiconductor substrate, a plurality of word lines formed on the semiconductor substrate at predetermined intervals, a selecting transistor arranged on each of two sides of each of the plurality of word lines in which a spacing between the selecting transistor and an adjacent one of the word lines is not less than three times a width of each of the word lines, an interlayer insulating film formed to cover upper surfaces of the word lines and selecting transistors, a first cavity portion which is located between each pair of adjacent ones of the word lines and whose upper portion is covered with the interlayer insulating film, a second cavity portion which is formed at a side wall portion of the word line adjacent to each selecting transistor which faces the selecting transistor and whose upper portion is covered with the interlayer insulating film, and a third cavity portion which is formed at a side wall portion of each of the selecting transistors and whose upper portion is covered with the interlayer insulating film.
摘要:
A stacked gate nonvolatile semiconductor memory includes at least a memory cell transistor and a selective gate transistor which are formed on a semiconductor substrate. The memory cell transistor includes a floating gate made of a semiconductor material below an interlayer insulating layer and a control gate made of a silicide above the interlayer insulating layer. The selective gate transistor includes a semiconductor layer made of the semiconductor material, a silicide layer made of the silicide and a conductive layer made of a conductive material not subject to silicide process which is formed through the interlayer insulating film so as to electrically connect the semiconductor layer and the silicide layer.
摘要:
A semiconductor storage device has a plurality of word lines formed with a predetermined interval on a semiconductor substrate, a selection transistor provided at an end portion of the plurality of word lines, a first insulating film formed so as to cover side surfaces of the word lines, a side surface of the selection transistor, and a surface of the semiconductor substrate between the word lines, a high-permittivity film formed on the first insulation film, a second insulating film formed so as to cover the upper surface of the word lines and the selection transistor, a first air-gap portion located between the word lines and surrounded by the high-permittivity film and the second insulating film, and a second air-gap portion formed via the first insulating film and the high-permittivity film at a sidewall portion, which opposes the selection transistor, of the word line adjacent to the selection transistor, an upper portion of the second air-gap portion being covered by the second insulating film.
摘要:
A semiconductor storage device has a plurality of word lines formed with a predetermined interval on a semiconductor substrate, a selection transistor provided at an end portion of the plurality of word lines, a first insulating film formed so as to cover side surfaces of the word lines, a side surface of the selection transistor, and a surface of the semiconductor substrate between the word lines, a high-permittivity film formed on the first insulation film, a second insulating film formed so as to cover the upper surface of the word lines and the selection transistor, a first air-gap portion located between the word lines and surrounded by the high-permittivity film and the second insulating film, and a second air-gap portion formed via the first insulating film and the high-permittivity film at a sidewall portion, which opposes the selection transistor, of the word line adjacent to the selection transistor, an upper portion of the second air-gap portion being covered by the second insulating film.
摘要:
A semiconductor memory device has a semiconductor substrate, a plurality of word lines formed on the semiconductor substrate at predetermined intervals, a selecting transistor arranged on each of two sides of each of the plurality of word lines in which a spacing between the selecting transistor and an adjacent one of the word lines is not less than three times a width of each of the word lines, an interlayer insulating film formed to cover upper surfaces of the word lines and selecting transistors, a first cavity portion which is located between each pair of adjacent ones of the word lines and whose upper portion is covered with the interlayer insulating film, a second cavity portion which is formed at a side wall portion of the word line adjacent to each selecting transistor which faces the selecting transistor and whose upper portion is covered with the interlayer insulating film, and a third cavity portion which is formed at a side wall portion of each of the selecting transistors and whose upper portion is covered with the interlayer insulating film.
摘要:
A stacked gate nonvolatile semiconductor memory includes at least a memory cell transistor and a selective gate transistor which are formed on a semiconductor substrate. The memory cell transistor includes a floating gate made of a semiconductor material below an interlayer insulating layer and a control gate made of a silicide above the interlayer insulating layer. The selective gate transistor includes a semiconductor layer made of the semiconductor material, a silicide layer made of the silicide and a conductive layer made of a conductive material not subject to silicide process which is formed through the interlayer insulating film so as to electrically connect the semiconductor layer and the silicide layer.
摘要:
A semiconductor storage device has a plurality of word lines formed with a predetermined interval on a semiconductor substrate, a selection transistor provided at an end portion of the plurality of word lines, a first insulating film formed so as to cover side surfaces of the word lines, a side surface of the selection transistor, and a surface of the semiconductor substrate between the word lines, a high-permittivity film formed on the first insulation film, a second insulating film formed so as to cover the upper surface of the word lines and the selection transistor, a first air-gap portion located between the word lines and surrounded by the high-permittivity film and the second insulating film, and a second air-gap portion formed via the first insulating film and the high-permittivity film at a sidewall portion, which opposes the selection transistor, of the word line adjacent to the selection transistor, an upper portion of the second air-gap portion being covered by the second insulating film.
摘要:
According to one embodiment, a semiconductor memory device includes a plurality of word lines formed on a semiconductor substrate at predetermined intervals, selecting transistors arranged on at least one side of the plurality of word lines, an interlayer insulating film formed to cover upper surfaces of the word lines and the selecting transistors, a first air gap located between each pair of adjacent ones of the word lines and covered by the interlayer insulating film, a second air gap located at a first side wall portion of a word line adjacent to the selecting transistors covered by the interlayer insulating film, the first side wall portion facing the selecting transistors, and a third air gap located at a second side wall portion of each of the selecting transistors and covered by the interlayer insulating film. The first, second, and third air gaps are filled with air.