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18 条记录 (耗时 0.028 秒)

    Ink-jet head and method for producing the same
    4.
    发明授权
    Ink-jet head and method for producing the same 失效
    喷墨头及其制造方法

    公开(公告)号：US06877845B2

    公开(公告)日：2005-04-12

    申请号：US10346845

    申请日：2003-01-17

    申请人： Hiroaki Nakashima

    发明人： Hiroaki Nakashima

    IPC分类号： B41J2/14 ,  B41J2/16 ,  B41J2/045

    CPC分类号： B41J2/1623 ,  B41J2/161 ,  B41J2002/14362

    摘要： The ink-jet head includes: a nozzle plate having a plurality of nozzles; a head body including a plurality of pressure chambers for storing ink, the pressure chambers communicating with the respective nozzles, and a plurality of actuators for applying pressure to the ink in the pressure chambers to allow the ink to be discharged from the nozzles; and a bonding layer made of an adhesive formed between the nozzle plate and the head body for bonding the nozzle plate and the head body together. A passage extending from an inner region to an outer region is formed in the bonding layer.

    摘要翻译： 喷墨头包括：具有多个喷嘴的喷嘴板; 头主体，包括用于存储墨的多个压力室，与各个喷嘴连通的压力室，以及用于向压力室中的墨施加压力以允许墨从喷嘴排出的多个致动器; 以及由喷嘴板和头部本体之间形成的用于将喷嘴板和头体结合在一起的粘合剂形成的粘合层。 在接合层中形成从内部区域延伸到外部区域的通道。

    Ink jet recording apparatus
    6.
    发明申请
    Ink jet recording apparatus 有权
    喷墨记录装置

    公开(公告)号：US20050001868A1

    公开(公告)日：2005-01-06

    申请号：US10833116

    申请日：2004-04-28

    申请人： Hiroyuki Matsuba ,  Tohru Nakagawa ,  Hideo Torii ,  Takeshi Kamada ,  Kazunari Chikanawa ,  Hiroaki Nakashima ,  Seishi Tomari

    发明人： Hiroyuki Matsuba ,  Tohru Nakagawa ,  Hideo Torii ,  Takeshi Kamada ,  Kazunari Chikanawa ,  Hiroaki Nakashima ,  Seishi Tomari

    IPC分类号： B41J2/14 ,  B41J2/155 ,  B41J29/38

    CPC分类号： B41J2/155 ,  B41J2/14233 ,  B41J2/1433 ,  B41J2002/14362 ,  B41J2002/14475 ,  B41J2002/14491 ,  B41J2202/20

    摘要： An ink jet recording apparatus, which performs printing by ink ejection, comprises a pressure chamber in which ink liquid is filled; a nozzle hole 116 which is formed communicating with the pressure chamber; a piezoelectric element 113 which is formed on the pressure chamber, and deforms the pressure chamber by mechanical expansion and contraction, whereby pressure is generated in the pressure chamber and ink is ejected from the nozzle hole 116; and a dew point control unit 123 which keeps a dew point in an atmosphere of the piezoelectric element 113 and the vicinity of the piezoelectric element 113 at a lower value than a dew point in an environment where the ink jet recording apparatus is set. The dew point control unit 123 comprises a compressor 123a, and an air drier 123b which dries compression gas from this compressor 123a and feeds it to the piezoelectric element 113.

    摘要翻译： 通过喷墨进行打印的喷墨记录装置包括其中填充有墨液的压力室; 与压力室连通的喷嘴孔116; 压电元件113，其形成在压力室上，并且通过机械膨胀和收缩使压力室变形，由此在压力室中产生压力，并且从喷嘴孔116喷射墨; 以及露点控制单元123，其在设置有喷墨记录装置的环境中，将压电元件113的气氛中的露点和压电元件113的附近保持在低于露点的值。 露点控制单元123包括压缩机123a和干燥来自该压缩机123a的压缩气体并将其馈送到压电元件113的空气干燥器123b。

    Method of Producing Semiconductor Device and Semiconductor Device
    9.
    发明申请
    Method of Producing Semiconductor Device and Semiconductor Device 有权
    生产半导体器件和半导体器件的方法

    公开(公告)号：US20080258267A1

    公开(公告)日：2008-10-23

    申请号：US11884536

    申请日：2006-02-08

    申请人： Hiroaki Nakashima

    发明人： Hiroaki Nakashima

    IPC分类号： H01L23/538 ,  H01L21/304 ,  H01L21/768

    CPC分类号： H01L21/76898 ,  H01L21/304 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    摘要： A method of producing a semiconductor device which can reliably perform conductor filling to form a through hole electrode by a simple method is provided. A method of producing a semiconductor device of the present invention includes the steps of thinning a substrate from its back side in a state in which a first supporting body is attached to the front side of the substrate, removing the first supporting body from the substrate and attaching a second supporting body having an opening to the back side of the substrate, forming a through hole communicating with the opening of the second supporting body in the substrate before or after attaching the second supporting body, forming an insulating film within the through hole, and filling a conductor into the through hole of the substrate.

    摘要翻译： 提供一种通过简单的方法制造能够可靠地进行导体填充以形成通孔电极的半导体器件的制造方法。 本发明的半导体装置的制造方法包括以下步骤：在基板的正面安装有第一支撑体的状态下，将基板从其背面变薄，从基板移除第一支撑体， 将具有开口的第二支撑体附接到基板的背面，在安装第二支撑体之前或之后形成与基板中的第二支撑体的开口连通的通孔，在通孔内形成绝缘膜， 并将导体填充到基板的通孔中。