公开(公告)号：US09435016B2

公开(公告)日：2016-09-06

申请号：US13808351

申请日：2010-07-07

申请人： Takeshi Sakurai ,  Yoshio Abe ,  Akira Saito ,  Yoshihiro Kameyama

发明人： Takeshi Sakurai ,  Yoshio Abe ,  Akira Saito ,  Yoshihiro Kameyama

IPC分类号： C22F1/08 ,  C22C9/06 ,  H01B1/02 ,  C22C9/04 ,  C22F1/00 ,  C22C9/10

CPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  H01B1/026

摘要： The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.

摘要翻译： Cu-Ni-Si系铜合金板含有1.0质量％〜3.0质量％的Ni，Si的质量％浓度为⅙〜¼的Si，余量为Cu和不可避免的杂质， 当合金结构中每个晶粒的纵横比（晶粒的短轴/晶粒的长轴）的平均值为0.4至0.6时，所有晶粒中GOS的平均值为1.2°至 1.5°，特殊晶界的总特殊晶界长度Lσ与晶界的总晶界长L的比（Lσ/ L）为60％〜70％，弹性弯曲弹性极限为450N / mm2〜600N / mm2，耐热焊接性良好，在150℃，1000小时时深冲加工性优异。

公开(公告)号：US20130167988A1

公开(公告)日：2013-07-04

申请号：US13808351

申请日：2010-07-07

申请人： Takeshi Sakurai ,  Yoshio Abe ,  Akira Saito ,  Yoshihiro Kameyama

发明人： Takeshi Sakurai ,  Yoshio Abe ,  Akira Saito ,  Yoshihiro Kameyama

IPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/10 ,  C22C9/06

CPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  H01B1/026

摘要： The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.

摘要翻译： Cu-Ni-Si系铜合金板含有1.0质量％〜3.0质量％的Ni，Si的浓度为Ni的质量％浓度的1/6〜¼，余量为Cu和不可避免的杂质， 当合金结构中每个晶粒的纵横比（晶粒的短轴/晶粒长轴）的平均值为0.4至0.6时，所有晶粒中GOS的平均值为1.2 °至1.5°，特殊晶界的总特殊晶界长度Lsigma与晶界边界长度L之比（Lsigma / L）为60％至70％，弹簧弯曲弹性极限为450 N / mm 2〜600N / mm 2，耐热耐热性良好，150℃下1000小时的深冲加工性优异。

公开(公告)号：US09255310B2

公开(公告)日：2016-02-09

申请号：US12801359

申请日：2010-06-04

申请人： Takeshi Sakurai ,  Yoshihiro Kameyama ,  Yoshio Abe

发明人： Takeshi Sakurai ,  Yoshihiro Kameyama ,  Yoshio Abe

IPC分类号： C22C9/00 ,  H01B5/02 ,  C22F1/08

CPC分类号： C22C9/00 ,  C22F1/08

摘要： A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm2, and a bending elastic limit value is 472 to 503 N/mm2.

摘要翻译： 铜合金材料以质量％计含有0.3〜2％的Mg，0.001〜0.1％的P，余量包含Cu和不可避免的杂质。 在每个晶粒中的所有像素之间的平均取向度小于4°的这种晶粒的面积分数是测量面积的45至55％，当铜的表面的测量区域中的所有像素的取向 合金材料通过电子背散射衍射图像系统的扫描电子显微镜和相邻像素之间的取向偏差为5°以上的边界的EBSD法测定为晶界，拉伸强度为641〜 708N / mm2，弯曲弹性极限值为472〜503N / mm2。

公开(公告)号：US20110146855A1

公开(公告)日：2011-06-23

申请号：US12801359

申请日：2010-06-04

申请人： Takeshi Sakurai ,  Yoshihiro Kameyama ,  Yoshio Abe

发明人： Takeshi Sakurai ,  Yoshihiro Kameyama ,  Yoshio Abe

IPC分类号： C22F1/08 ,  C22C9/00

CPC分类号： C22C9/00 ,  C22F1/08

摘要： A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm2, and a bending elastic limit value is 472 to 503 N/mm2.

摘要翻译： 铜合金材料以质量％计含有0.3〜2％的Mg，0.001〜0.1％的P，余量包含Cu和不可避免的杂质。 在每个晶粒中的所有像素之间的平均取向度小于4°的这种晶粒的面积分数是测量面积的45至55％，当铜的表面的测量区域中的所有像素的取向 合金材料通过电子背散射衍射图像系统的扫描电子显微镜和相邻像素之间的取向偏差为5°以上的边界的EBSD法测定为晶界，拉伸强度为641〜 708N / mm2，弯曲弹性极限值为472〜503N / mm2。