公开(公告)号：US20200033285A1

公开(公告)日：2020-01-30

申请号：US16491247

申请日：2018-02-26

申请人： Taketomo NAKANE

发明人： Taketomo NAKANE

IPC分类号： G01N27/22 ,  H01L21/311 ,  H01L49/02 ,  G01N27/04

摘要： A humidity sensor includes a lower electrode formed above a substrate, a first humidity sensing film covering the lower electrode, an upper electrode formed above the first humidity sensing film, and a second humidity sensing film covering the upper electrode and making contact with the first humidity sensing film through openings of the upper electrode. The upper electrode has a predetermined opening pattern. The area of the upper electrode is larger than the area of the lower electrode, and is smaller than the area of the first humidity sensing film.

公开(公告)号：US20220310399A1

公开(公告)日：2022-09-29

申请号：US17655828

申请日：2022-03-22

申请人： Taketomo NAKANE ,  Etsuji HAYAKAWA

发明人： Taketomo NAKANE ,  Etsuji HAYAKAWA

IPC分类号： H01L21/304 ,  H01L21/78 ,  H01L21/56 ,  H01L21/027

摘要： A method for manufacturing a semiconductor device includes providing a wafer that includes a device region and a peripheral region of the device region, the device region including multiple chip regions. The method includes removing a portion of the peripheral region such that the removed portion has an annular shape. The method includes forming a protective layer on a first surface of the wafer. The method includes grinding a second surface of the wafer in which the protective layer is formed on the first surface.

公开(公告)号：US20220315413A1

公开(公告)日：2022-10-06

申请号：US17656446

申请日：2022-03-25

申请人： Etsuji HAYAKAWA ,  Taketomo NAKANE

发明人： Etsuji HAYAKAWA ,  Taketomo NAKANE

IPC分类号： B81B7/00 ,  B81C1/00

摘要： A sensing device includes a lead frame, a first insulating film, a semiconductor integrated circuit chip provided over the lead frame via the first insulating film, and a first bonding wire via which an external derivation lead and the semiconductor integrated circuit chip are electrically coupled to each other. The sensing device includes a sensor chip disposed over the semiconductor integrated circuit chip such that a first surface of the sensor chip faces the semiconductor integrated circuit chip. The sensing device includes a sensor provided on a second surface of the sensor chip. The sensing device includes a molding resin with which the lead frame, the semiconductor integrated circuit chip, the sensor chip, and the first bonding wire are sealed. The sensor chip is electrically coupled to the semiconductor integrated circuit chip, and the molding resin has an opening in which the sensor is exposed.