公开(公告)号：US20210292471A1

公开(公告)日：2021-09-23

申请号：US17266209

申请日：2019-08-07

Applicant: Teijin Limited

Inventor： Suguru OZAWA ,  Akimichi ODA ,  Hideaki TOMINAGA ,  Hiroaki KUWAHARA

IPC: C08G59/32 ,  C08G59/50 ,  C08J5/24 ,  C08J5/04 ,  C07D303/36

Abstract: The present invention provides an epoxy compound indicated by chemical formula (1) (in chemical formula (1), X indicates a C1-10 aliphatic hydrocarbon group, R1 and R2 each independently indicate one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic group, an alkoxy group, and a halogen atom.)

公开(公告)号：US20230331906A1

公开(公告)日：2023-10-19

申请号：US18210769

申请日：2023-06-16

Applicant: TEIJIN LIMITED

Inventor： Akimichi ODA ,  Hiroaki KUWAHARA ,  Hironori KAWAMOTO

IPC: C08G59/50 ,  C08J5/24

CPC classification number: C08G59/50 ,  C08J5/243 ,  C08J2363/00 ,  C08J2377/00 ,  C08J2381/06

Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.

公开(公告)号：US20200291198A1

公开(公告)日：2020-09-17

申请号：US16768407

申请日：2018-11-28

Applicant: TEIJIN LIMITED

Inventor： Akimichi ODA ,  Hiroaki KUWAHARA ,  Hironori KAWAMOTO

IPC: C08J5/24 ,  C08G59/50

Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.

公开(公告)号：US20220017698A1

公开(公告)日：2022-01-20

申请号：US17298305

申请日：2019-11-26

Applicant: TEIJIN LIMITED

Inventor： Miki HORIKAWA ,  Takaya SUZUKI ,  Hiroaki KUWAHARA

IPC: C08G73/12 ,  C08L79/08 ,  C08J5/24 ,  C09J7/38 ,  C09J7/10

Abstract: The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.

公开(公告)号：US20220195134A1

公开(公告)日：2022-06-23

申请号：US17604607

申请日：2020-04-02

Applicant: TEIJIN LIMITED

Inventor： Akimichi ODA ,  Hiroaki KUWAHARA

IPC: C08J5/24 ,  C08G65/26

Abstract: An object of the invention is to provide a thermoplastic resin prepreg that gives a fiber-reinforced composite material with excellent mechanical strength even through molding at a low temperature within a short period of time. The thermoplastic resin prepreg of the invention is a thermoplastic resin prepreg including at least a reinforcing fiber substrate and a thermoplastic resin composition partially or completely impregnated in the reinforcing fiber substrate. The thermoplastic resin prepreg is configured such that the thermoplastic resin composition contains 50 mass % or more of polyetherketoneketone (PEKK) based on the total thermoplastic resin composition, and is a thermoplastic resin composition having a crystallization enthalpy of 22 J/g or more as measured by a differential scanning calorimeter (DSC) at a cooling rate of 50° C./min from 400° C.

公开(公告)号：US20190062511A1

公开(公告)日：2019-02-28

申请号：US16093367

申请日：2017-04-13

Applicant: TEIJIN LIMITED

Inventor： Kazuma KUROKAWA ,  Tetsuya AKAMATSU ,  Hiroaki KUWAHARA

IPC: C08J5/24 ,  C08J5/06 ,  B32B27/12

Abstract: The present invention provides a prepreg which is composed of at least a matrix resin and reinforcing fibers, and which is characterized in that: conductive parts are formed on one surface or both surfaces of a fiber layer that is formed of the reinforcing fibers; and the volume resistivity ρ (Ωcm) of the fiber layer in the thickness direction, the thickness t (cm) of the fiber layer and the average interval L (cm) between the conductive parts arranged on the prepreg surface satisfy formula (1). t/ρ×1/L×100≥0.5   Formula (1):