公开(公告)号：US20220195134A1

公开(公告)日：2022-06-23

申请号：US17604607

申请日：2020-04-02

Applicant: TEIJIN LIMITED

Inventor： Akimichi ODA ,  Hiroaki KUWAHARA

IPC: C08J5/24 ,  C08G65/26

Abstract: An object of the invention is to provide a thermoplastic resin prepreg that gives a fiber-reinforced composite material with excellent mechanical strength even through molding at a low temperature within a short period of time. The thermoplastic resin prepreg of the invention is a thermoplastic resin prepreg including at least a reinforcing fiber substrate and a thermoplastic resin composition partially or completely impregnated in the reinforcing fiber substrate. The thermoplastic resin prepreg is configured such that the thermoplastic resin composition contains 50 mass % or more of polyetherketoneketone (PEKK) based on the total thermoplastic resin composition, and is a thermoplastic resin composition having a crystallization enthalpy of 22 J/g or more as measured by a differential scanning calorimeter (DSC) at a cooling rate of 50° C./min from 400° C.

公开(公告)号：US20240141096A1

公开(公告)日：2024-05-02

申请号：US18278138

申请日：2022-02-28

Applicant: TEIJIN LIMITED

Inventor： Suguru OZAWA ,  Akimichi ODA ,  Kohei OSAKI ,  Toru KANEKO

IPC: C08G59/50 ,  C08G59/24 ,  C08G59/28 ,  C08G59/32 ,  C08G59/38 ,  C08J5/04 ,  C08L9/00

CPC classification number: C08G59/5033 ,  C08G59/245 ,  C08G59/28 ,  C08G59/3227 ,  C08G59/38 ,  C08J5/042 ,  C08L9/00 ,  C08J2363/00 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/22

Abstract: An epoxy resin composition contains a curing agent A, a curing agent B, a curing agent C, an epoxy resin D, an epoxy resin E, and resin particles F, wherein the curing agent A is an aromatic polyamine having a substituent selected from an alkyl group, an aromatic group, and a halogen group at each of two ortho positions of an amino group, the curing agent B is an aromatic polyamine that is liquid at 25° C., and the curing agent C is an aromatic polyamine having only one electron donating substituent or no substituent at an ortho position of an amino group, the epoxy resin D is constituted by an epoxy resin which is composed of a monomer containing 4 or more glycidyl groups, and the epoxy resin E is constituted by an epoxy resin which is composed of a monomer containing 2 or 3 glycidyl groups.

公开(公告)号：US20240247118A1

公开(公告)日：2024-07-25

申请号：US18624323

申请日：2024-04-02

Applicant: Teijin Limited

Inventor： Akimichi ODA ,  Hiroaki Kuwahara

IPC: C08J5/24 ,  C08G65/26

CPC classification number: C08J5/243 ,  C08G65/2612 ,  C08G2650/40 ,  C08J2371/00

Abstract: An object of the invention is to provide a thermoplastic resin prepreg that gives a fiber-reinforced composite material with excellent mechanical strength even through molding at a low temperature within a short period of time. The thermoplastic resin prepreg of the invention is a thermoplastic resin prepreg including at least a reinforcing fiber substrate and a thermoplastic resin composition partially or completely impregnated in the reinforcing fiber substrate. The thermoplastic resin prepreg is configured such that the thermoplastic resin composition contains 50 mass % or more of polyetherketoneketone (PEKK) based on the total thermoplastic resin composition, and is a thermoplastic resin composition having a crystallization enthalpy of 22 J/g or more as measured by a differential scanning calorimeter (DSC) at a cooling rate of 50° C./min from 400° C.

公开(公告)号：US20210292471A1

公开(公告)日：2021-09-23

申请号：US17266209

申请日：2019-08-07

Applicant: Teijin Limited

Inventor： Suguru OZAWA ,  Akimichi ODA ,  Hideaki TOMINAGA ,  Hiroaki KUWAHARA

IPC: C08G59/32 ,  C08G59/50 ,  C08J5/24 ,  C08J5/04 ,  C07D303/36

Abstract: The present invention provides an epoxy compound indicated by chemical formula (1) (in chemical formula (1), X indicates a C1-10 aliphatic hydrocarbon group, R1 and R2 each independently indicate one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic group, an alkoxy group, and a halogen atom.)

公开(公告)号：US20240343871A1

公开(公告)日：2024-10-17

申请号：US18294380

申请日：2022-07-28

Applicant: TEIJIN LIMITED

Inventor： Akimichi ODA ,  Takaya SUZUKI ,  Takuro KOBAYASHI

IPC: C08J5/24

CPC classification number: C08J5/243 ,  C08J2371/00

Abstract: Provided is a thermoplastic resin prepreg comprising a fiber-reinforced substrate and a thermoplastic resin composition partially or completely impregnated in the fiber-reinforced substrate, the thermoplastic resin prepreg being characterized in that the thermoplastic resin composition contains at least 50 [mass %] of polyether ether ketone among all the thermoplastic resins contained in the thermoplastic resin composition, and the sum of the crystallinity WC [%] of the thermoplastic resin composition and the rigid amorphous component proportion WRAP [%] in the thermoplastic resin composition is in the range of 51 to 100 [%].

公开(公告)号：US20230331906A1

公开(公告)日：2023-10-19

申请号：US18210769

申请日：2023-06-16

Applicant: TEIJIN LIMITED

Inventor： Akimichi ODA ,  Hiroaki KUWAHARA ,  Hironori KAWAMOTO

IPC: C08G59/50 ,  C08J5/24

CPC classification number: C08G59/50 ,  C08J5/243 ,  C08J2363/00 ,  C08J2377/00 ,  C08J2381/06

Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.

公开(公告)号：US20230272577A1

公开(公告)日：2023-08-31

申请号：US18014443

申请日：2021-07-02

Applicant: TEIJIN LIMITED

Inventor： Taisuke FUJIMOTO ,  Akimichi ODA ,  Hidekazu YOSHIKAWA

IPC: D06M15/55 ,  D06M15/507 ,  D06M15/53

CPC classification number: D06M15/55 ,  D06M15/507 ,  D06M15/53 ,  D06M2200/40 ,  D06M2101/40

Abstract: A carbon fiber bundle having a high abrasion resistance property and simultaneously being excellent in widening property is provided by a carbon fiber bundle with an adhered sizing agent including a carbon fiber bundle, and a sizing agent adhered to a surface of the carbon fiber bundle, wherein the sizing agent contains an epoxy compound, and shows an intersection of a storage modulus and a loss modulus at an angular frequency in the range of 1×105 to 1×109 rad/sec in a measurement at 25° C.

公开(公告)号：US20200291198A1

公开(公告)日：2020-09-17

申请号：US16768407

申请日：2018-11-28

Applicant: TEIJIN LIMITED

Inventor： Akimichi ODA ,  Hiroaki KUWAHARA ,  Hironori KAWAMOTO

IPC: C08J5/24 ,  C08G59/50

Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.