公开(公告)号：US20240087776A1

公开(公告)日：2024-03-14

申请号：US18243632

申请日：2023-09-07

Applicant: Tektronix, Inc.

Inventor： Julie A. Campbell ,  Christopher R. Muggli ,  Daniel G. Knierim ,  David M. Ediger ,  Richard N. Atherton

IPC: H01C7/00 ,  G01R1/067

CPC classification number: H01C7/00 ,  G01R1/067

Abstract: A shunt resistor has a substrate having electrically conductive structures to carry current in a current path, a resistive portion in electrical contact with the electrically conductive structures, and one or more canceling inductance leads electrically connected to the electrically conductive structures and the resistive portion, the one or more canceling inductance configured to cancel inductive effects in a voltage measurement across the resistive portion. A modular tip interconnect has a connector at a first end of the interconnect configured to connect to a probe tip of a test and measurement instrument, and the above shunt resistor located at a second end of the interconnect configured to connect to a device under test (DUT).