公开(公告)号：US06629784B1

公开(公告)日：2003-10-07

申请号：US09101276

申请日：1998-06-30

Applicant: Terry Bricheno ,  James Wilson Parker

Inventor： Terry Bricheno ,  James Wilson Parker

IPC: G02B6255

CPC classification number: G02B6/4206 ,  G02B6/4203

Abstract: An assembly for combining the outputs from a group of n single mode optical fibres on to the photosensitive surface of a photodetector (1) has an adiabatically tapered bundle (2) of fibres (3) the small end of which is fusion spliced to one end of a length (4) of multimode fibre whose other end is optically coupled with the detector (1) by means of a lens (5).

Abstract translation: 用于将来自一组n个单模光纤的输出组合到光电检测器（1）的感光表面上的组件具有绝热的锥形束（2）的纤维（3），其小端熔接到一端 （4）的多模光纤，其另一端通过透镜（5）与检测器（1）光学耦合。

公开(公告)号：US5986572A

公开(公告)日：1999-11-16

申请号：US634912

申请日：1996-04-19

Applicant: James Wilson Parker ,  Ernst August Munter

Inventor： James Wilson Parker ,  Ernst August Munter

IPC: H04Q3/52 ,  H04Q3/68 ,  H04Q3/00

CPC classification number: H04Q3/68

Abstract: A telecommunications switch has a matrix architecture of n.times.m bus-interconnected, or space-switch interconnected, switch nodes together with additional switch nodes and n.times.m switch peripherals connected to the switch nodes externally of the bus (space-switch) interconnected switch node matrix. Fault protection redundancy is provided by providing each one of the peripherals with connections to two different switch nodes only one of which is enabled at any one time.

Abstract translation: 电信交换机具有nxm总线互连或空间交换互连的交换节点与连接到总线（空间交换机）互连交换机节点矩阵外部的交换节点的附加交换节点和nxm交换机外围设备的矩阵体系结构。 通过为每个外围设备提供连接到两个不同的交换机节点提供故障保护冗余，其中只有一个可以在任何一个时间启用。

公开(公告)号：US5933707A

公开(公告)日：1999-08-03

申请号：US612314

申请日：1996-03-07

Applicant: Peter John Ayliffe ,  James Wilson Parker ,  Paul Mark Harrison ,  Robert George Peall ,  Martin Christopher Geear ,  Roger William Harcourt

Inventor： Peter John Ayliffe ,  James Wilson Parker ,  Paul Mark Harrison ,  Robert George Peall ,  Martin Christopher Geear ,  Roger William Harcourt

IPC: C30B33/08 ,  G02B6/36 ,  G02B6/43 ,  H01L21/306 ,  H01L21/98 ,  H01L23/13 ,  H01L23/14 ,  H01L21/44

CPC classification number: H01L25/50 ,  H01L23/13 ,  H01L23/147 ,  G02B6/43 ,  H01L2924/0002 ,  H01L2924/3011

Abstract: This disclosure relates to the fabrication of components on a single crystal substrate. A method is disclosed of overcoming the problems encountered in defining etched features on a silicon substrate. In particular, there is disclosed a method of producing a multichip module comprising a silicon substrate having surface features for the placement of components. An organic dielectric is applied to the substrate prior to the use of an etchant whereby interconnects can be defined.

Abstract translation: 本公开涉及在单晶衬底上制造组件。 公开了一种克服在硅衬底上限定蚀刻特征时遇到的问题的方法。 特别地，公开了一种制造多芯片模块的方法，该多芯片模块包括具有用于放置部件的表面特征的硅基板。 在使用蚀刻剂之前，将有机电介质施加到衬底上，从而可以定义互连。