Nitride semiconductor light-emitting device and method for producing same
    3.
    发明申请
    Nitride semiconductor light-emitting device and method for producing same 有权
    氮化物半导体发光器件及其制造方法

    公开(公告)号:US20080283866A1

    公开(公告)日:2008-11-20

    申请号:US12216533

    申请日:2008-07-07

    IPC分类号: H01L33/00

    摘要: In a method for producing a nitride semiconductor light-emitting device according to the present invention, first, a nitride semiconductor substrate having groove portions formed is prepared. An underlying layer comprising nitride semiconductor is formed on the nitride semiconductor substrate including the side walls of the groove portions, in such a manner that the underlying layer has a crystal surface in each of the groove portions and the crystal surface is tilted at an angle of from 53.5° to 63.4° with respect to the surface of the substrate. Over the underlying layer, a light-emitting-device structure composed of a lower cladding layer containing Al, an active layer, and an upper cladding layer containing Al is formed. According to the present invention, thickness nonuniformity and lack of surface flatness, which occur when accumulating a layer with light-emitting-device structure of nitride semiconductor over the nitride semiconductor substrate, are alleviated while inhibiting occurrence of cracking.

    摘要翻译: 在本发明的氮化物半导体发光元件的制造方法中,首先,准备形成有槽部的氮化物半导体基板。 在包括沟槽部分的侧壁的氮化物半导体衬底上形成包括氮化物半导体的下层,使得下层在每个沟槽部分中具有晶体表面,并且晶体表面以 相对于基板的表面为53.5°〜63.4°。 在下层之上,形成由包含Al的下包层,有源层和含有Al的上包层组成的发光器件结构。 根据本发明,在氮化物半导体衬底上堆积具有氮化物半导体的发光器件结构的层时发生的厚度不均匀性和表面平坦度不足,同时抑制裂纹的发生。

    Nitride semiconductor light-emitting device and method for producing same

    公开(公告)号:US07410819B2

    公开(公告)日:2008-08-12

    申请号:US11296532

    申请日:2005-12-08

    IPC分类号: H01L21/20

    摘要: In a method for producing a nitride semiconductor light-emitting device according to the present invention, first, a nitride semiconductor substrate having groove portions formed is prepared. An underlying layer comprising nitride semiconductor is formed on the nitride semiconductor substrate including the side walls of the groove portions, in such a manner that the underlying layer has a crystal surface in each of the groove portions and the crystal surface is tilted at an angle of from 53.5° to 63.4° with respect to the surface of the substrate. Over the underlying layer, a light-emitting-device structure composed of a lower cladding layer containing Al, an active layer, and an upper cladding layer containing Al is formed. According to the present invention, thickness nonuniformity and lack of surface flatness, which occur when accumulating a layer with light-emitting-device structure of nitride semiconductor over the nitride semiconductor substrate, are alleviated while inhibiting occurrence of cracking.

    Nitride semiconductor light-emitting device
    5.
    发明授权
    Nitride semiconductor light-emitting device 有权
    氮化物半导体发光器件

    公开(公告)号:US07700963B2

    公开(公告)日:2010-04-20

    申请号:US12216533

    申请日:2008-07-07

    IPC分类号: H01L33/00

    摘要: In a method for producing a nitride semiconductor light-emitting device according to the present invention, first, a nitride semiconductor substrate having groove portions formed is prepared. An underlying layer comprising nitride semiconductor is formed on the nitride semiconductor substrate including the side walls of the groove portions, in such a manner that the underlying layer has a crystal surface in each of the groove portions and the crystal surface is tilted at an angle of from 53.5° to 63.4° with respect to the surface of the substrate. Over the underlying layer, a light-emitting-device structure composed of a lower cladding layer containing Al, an active layer, and an upper cladding layer containing Al is formed. According to the present invention, thickness nonuniformity and lack of surface flatness, which occur when accumulating a layer with light-emitting-device structure of nitride semiconductor over the nitride semiconductor substrate, are alleviated while inhibiting occurrence of cracking.

    摘要翻译: 在本发明的氮化物半导体发光元件的制造方法中,首先,准备形成有槽部的氮化物半导体基板。 在包括沟槽部分的侧壁的氮化物半导体衬底上形成包括氮化物半导体的下层,使得下层在每个沟槽部分中具有晶体表面,并且晶体表面以 相对于基板的表面为53.5°〜63.4°。 在下层之上,形成由包含Al的下包层,有源层和含有Al的上包层组成的发光器件结构。 根据本发明,在氮化物半导体衬底上堆积具有氮化物半导体的发光器件结构的层时发生的厚度不均匀性和表面平坦度不足,同时抑制裂纹的发生。

    Nitride semiconductor light-emitting device and method for producing same
    6.
    发明申请
    Nitride semiconductor light-emitting device and method for producing same 有权
    氮化物半导体发光器件及其制造方法

    公开(公告)号:US20060131590A1

    公开(公告)日:2006-06-22

    申请号:US11296532

    申请日:2005-12-08

    IPC分类号: H01L21/00 H01L33/00

    摘要: In a method for producing a nitride semiconductor light-emitting device according to the present invention, first, a nitride semiconductor substrate having groove portions formed is prepared. An underlying layer comprising nitride semiconductor is formed on the nitride semiconductor substrate including the side walls of the groove portions, in such a manner that the underlying layer has a crystal surface in each of the groove portions and the crystal surface is tilted at an angle of from 53.5° to 63.4° with respect to the surface of the substrate. Over the underlying layer, a light-emitting-device structure composed of a lower cladding layer containing Al, an active layer, and an upper cladding layer containing Al is formed. According to the present invention, thickness nonuniformity and lack of surface flatness, which occur when accumulating a layer with light-emitting-device structure of nitride semiconductor over the nitride semiconductor substrate, are alleviated while inhibiting occurrence of cracking.

    摘要翻译: 在本发明的氮化物半导体发光元件的制造方法中,首先,准备形成有槽部的氮化物半导体基板。 在包括沟槽部分的侧壁的氮化物半导体衬底上形成包括氮化物半导体的下层,使得下层在每个沟槽部分中具有晶体表面,并且晶体表面以 相对于基板的表面为53.5°〜63.4°。 在下层之上,形成由包含Al的下包层,有源层和含有Al的上包层组成的发光器件结构。 根据本发明,在氮化物半导体衬底上堆积具有氮化物半导体的发光器件结构的层时发生的厚度不均匀性和表面平坦度不足,同时抑制裂纹的发生。