METHOD FOR MANUFACTURING A LIGHT EMITTING SEMICONDUCTOR CHIP AND LIGHT EMITTING SEMICONDUCTOR CHIP

    公开(公告)号:US20240186765A1

    公开(公告)日:2024-06-06

    申请号:US18553434

    申请日:2022-04-13

    摘要: In an embodiment a method for manufacturing a light-emitting semiconductor chip includes providing a substrate having a main surface with at least one recess, the main surface having a main extension plane along the longitudinal direction and along a transversal direction perpendicular to the longitudinal direction, wherein the substrate has pre-patterning trenches formed along the transversal direction between chip regions and extending along the longitudinal direction, growing the semiconductor layer sequence on the main surface with the at least one recess and forming at least one facet aligned along the transversal direction in the semiconductor layer sequence by an etching process, wherein the facet has a distance of less than or equal to 50 μm from the at least one recess in at least one direction parallel to the main extension plane of the main surface.

    SURFACE EMITTING LASER AND SURFACE EMITTING LASER ARRAY

    公开(公告)号:US20240022040A1

    公开(公告)日:2024-01-18

    申请号:US18249550

    申请日:2021-10-20

    IPC分类号: H01S5/02 H01S5/42 H01S5/183

    摘要: A surface emitting laser according to one embodiment of the present disclosure includes: a substrate having a convex part provided on a surface thereof; and a vertical resonator structure formed on the substrate, and including an active layer, a first semiconductor layer, and a current blocking layer. The first semiconductor layer is a semiconductor layer of a first conductivity type having a step structure part having a shape conforming to the convex part at a location facing the convex part. The current blocking layer is a semiconductor layer of a second conductivity type different from the first conductivity type and having an opening in which an inner peripheral surface is in contact with an outer peripheral surface of the step structure part.

    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:US20240006840A1

    公开(公告)日:2024-01-04

    申请号:US18252580

    申请日:2021-10-29

    摘要: Provided are a light emitting device capable of providing lenses or light emitting elements on a substrate in a suitable manner, and a method for manufacturing the light emitting device. A light emitting device of the present disclosure includes: a first substrate; a light emitting element provided on a lower surface of the first substrate; a lens provided on an upper surface of the first substrate; a first protrusion provided on the upper surface of the first substrate; and a first film provided on the upper surface of the first substrate, the first film including a first portion disposed on the lens or forming the lens, and a second portion disposed on the first protrusion or forming the first protrusion, in which a height of an uppermost portion of the first portion is equal to or less than a height of an uppermost portion of the second portion.

    VCSEL STRUCTURE WITH EMBEDDED HEAT SINK
    9.
    发明申请
    VCSEL STRUCTURE WITH EMBEDDED HEAT SINK 有权
    VCSEL结构与嵌入式散热器

    公开(公告)号:US20170025815A1

    公开(公告)日:2017-01-26

    申请号:US15011562

    申请日:2016-01-31

    申请人: APPLE INC.

    摘要: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.

    摘要翻译: 光电子器件包括半导体衬底,其具有正面和背面,并且具有至少一个从背面穿过半导体衬底延伸到与前侧接近的腔。 至少一个光电子发射器形成在半导体衬底的与该至少一个腔相邻的正面上。 导热材料至少部分地填充至少一个空腔,并被配置为用作至少一个光电发射器的散热器。

    Quantum cascade laser
    10.
    发明授权
    Quantum cascade laser 有权
    量子级联激光器

    公开(公告)号:US09276381B2

    公开(公告)日:2016-03-01

    申请号:US14520500

    申请日:2014-10-22

    摘要: A quantum cascade laser includes a semiconductor substrate, and an active layer being provided on the substrate, and having a cascade structure in which quantum well emission layers and injection layers are alternately laminated, and the laser has a base portion including the substrate, and a stripe-shaped ridge portion including the active layer. Further, a reflection control film is formed from a ridge end face over a base end face on an end face in a resonating direction of the laser, and, on the base end face, for a second side and a third side adjacent to a first side on the ridge portion side of the base end face, and a fourth side facing the first side, the reflection control film is formed on a region other than regions near those three sides with predetermined widths.

    摘要翻译: 量子级联激光器包括半导体衬底,并且有源层设置在衬底上,并且具有量子阱发射层和注入层交替层叠的级联结构,并且激光器具有包括衬底的基部,以及 包括活性层的条纹状脊部。 此外,在激光的共振方向的端面上的基端面上的脊端面形成反射控制膜,并且在基端面上,与第一侧面相邻的第二侧面和第三侧面 在基端面的脊部侧的侧面以及面向第一侧的第四面,反射控制膜形成在除了三边以外的区域以外的区域上,具有预定的宽度。