公开(公告)号：US20240356255A1

公开(公告)日：2024-10-24

申请号：US18683758

申请日：2022-08-12

Applicant: Tesla, Inc.

Inventor： Rishabh Bhandari ,  Yong guo Li ,  Mohamed Haitham Helmy Nasr ,  Samuel Lichy ,  Aydin Nabovati ,  Shiva Farzinazar ,  Mitchell Heschke

IPC: H01R12/71 ,  H01R13/24 ,  H01R13/46 ,  H05K7/20

CPC classification number: H01R12/716 ,  H01R13/2421 ,  H01R13/46 ,  H05K7/20927

Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

公开(公告)号：US20240357729A1

公开(公告)日：2024-10-24

申请号：US18683754

申请日：2022-08-16

Applicant: Tesla, Inc.

Inventor： Mohamed Haitham Helmy Nasr ,  Samuel Lichy ,  Aydin Nabovati ,  Rishabh Bhandari ,  Yong guo Li ,  Zheng Gao

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K2201/064 ,  H05K2201/066

Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

公开(公告)号：US20240314980A1

公开(公告)日：2024-09-19

申请号：US18549342

申请日：2022-03-01

Applicant: Tesla, Inc.

Inventor： Mohamed Haitham Helmy Nasr ,  Aydin Nabovati ,  Aldrich Chester L. Ong ,  Jeffrey John Miller

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20454 ,  H05K1/0203 ,  H05K7/20254 ,  H05K7/20272

Abstract: A cold plate with an integrated sliding pedestal and a processing system including the same are provided. In one aspect, the processing system includes a printed circuit board (PCB), a first electronic component arranged over the PCB, and a thermal interface material (TIM) arranged over the first electronic component. The system includes at least one sliding pedestal arranged over the TIM. The sliding pedestal is configured to be spaced a variable distance from the PCB. The system also includes a cold plate arranged over the sliding pedestal and configured to provide a coolant to the sliding pedestal and to cool a second electronic component.