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公开(公告)号：US07670206B2
公开(公告)日：2010-03-02
申请号：US10559135
申请日：2004-06-17
申请人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
发明人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
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公开(公告)号：US07854646B2
公开(公告)日：2010-12-21
申请号：US12688021
申请日：2010-01-15
申请人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
发明人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
摘要翻译： 本发明涉及一种用于将诸如半导体晶片的基板抛光到平整的基板抛光装置和基板抛光方法。 基板研磨装置具备：具有研磨面（101）的研磨台（100），将基板（W）保持并压靠在研磨台（100）的研磨面（101）上的基板保持架（1），以及 用于测量衬底（W）上的膜的厚度的膜厚测量装置（200）。 衬底保持器（1）具有多个压力可调节室（22〜25），并且基于由膜厚测量装置（200）测量的膜厚调节各个室（22至25）中的压力。
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公开(公告)号：US20080139087A1
公开(公告)日：2008-06-12
申请号：US10559135
申请日：2004-06-17
申请人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
发明人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
摘要翻译： 本发明涉及一种用于将诸如半导体晶片的基板抛光到平整的基板抛光装置和基板抛光方法。 基板研磨装置具备：具有抛光面（101）的研磨台（100），将基板（W）保持并压靠在研磨台（100）的研磨面（101）上的基板保持架（1），以及 用于测量衬底（W）上的膜的厚度的膜厚测量装置（200）。 衬底保持器（1）具有多个压力可调节室（22〜25），并且基于由膜厚测量装置（200）测量的膜厚调节各个室（22至25）中的压力。
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公开(公告)号：US07867063B2
公开(公告)日：2011-01-11
申请号：US12453598
申请日：2009-05-15
IPC分类号： B24B7/22
摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
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公开(公告)号：US20050028931A1
公开(公告)日：2005-02-10
申请号：US10874317
申请日：2004-06-24
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304 , H01L21/306 , C23F1/00
CPC分类号： B24B37/30 , H01L21/30625
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.
摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平坦光洁度的基板保持装置。 基板保持装置包括用于保持基板的可垂直移动的顶环体和用于限定顶环体中的压力室的弹性膜。 将涂层施加到与基底接触的弹性膜的表面上。
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公开(公告)号：US07988537B2
公开(公告)日：2011-08-02
申请号：US12073430
申请日：2008-03-05
IPC分类号： B24B7/22
摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
摘要翻译： 基板保持装置用于将基板如半导体晶片保持在用于抛光基板的抛光装置中以达到平整。 基板保持装置包括可垂直移动的构件和用于限定腔室的弹性构件。 弹性构件包括与基板接触的接触部分和从接触部分向上延伸并连接到可垂直移动部件的圆周壁。 周壁具有可伸缩的部分，其可垂直伸缩。
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公开(公告)号：US20080166957A1
公开(公告)日：2008-07-10
申请号：US12073430
申请日：2008-03-05
IPC分类号： B24B7/22
摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
摘要翻译： 基板保持装置用于将基板如半导体晶片保持在用于抛光基板的抛光装置中以达到平整。 基板保持装置包括可垂直移动的构件和用于限定腔室的弹性构件。 弹性构件包括与基板接触的接触部分和从接触部分向上延伸并连接到可垂直移动部件的圆周壁。 周壁具有可伸缩的部分，其可垂直伸缩。
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公开(公告)号：US07108592B2
公开(公告)日：2006-09-19
申请号：US10874317
申请日：2004-06-24
CPC分类号： B24B37/30 , H01L21/30625
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.
摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 基板保持装置包括用于保持基板的可垂直移动的顶环体和用于限定顶环体中的压力室的弹性膜。 将涂层施加到与基底接触的弹性膜的表面上。
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公开(公告)号：US07357699B2
公开(公告)日：2008-04-15
申请号：US10543546
申请日：2004-02-04
IPC分类号： B24B7/22
摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
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公开(公告)号：US20060199479A1
公开(公告)日：2006-09-07
申请号：US10543546
申请日：2004-02-04
IPC分类号： B24B1/00
摘要： The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member (6), and an elastic member (7) for defining a chamber (22). The elastic member (7) comprises a contact portion (8) which is brought into contact with the substrate (W), and a circumferential wall (9) extending upwardly from the contact portion (8) and connected to the vertically movable member (6). The circumferential wall (9) has a stretchable and contractible portion (40) which is stretchable and contractible vertically.
摘要翻译： 本发明涉及一种用于将基板（W）例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 基板保持装置包括可垂直移动的构件（6）和用于限定腔室（22）的弹性构件（7）。 弹性构件（7）包括与基板（W）接触的接触部分（8）和从接触部分（8）向上延伸并连接到可垂直移动的部件（6）的周壁（9） ）。 周壁（9）具有可伸缩的部分（40），其可垂直伸缩。
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