公开(公告)号：US09772372B2

公开(公告)日：2017-09-26

申请号：US14168648

申请日：2014-01-30

申请人： Texas Instruments Incorporated

发明人： Hoi Hin Loo ,  Soh Ying Seah

IPC分类号： G01R31/28

CPC分类号： G01R31/2851 ,  G01R31/2853 ,  G01R31/287 ,  G01R31/2894

摘要： A method of testing semiconductor devices includes contacting bond pads coupled to integrated circuitry on a first die of a plurality of interconnected die on a substrate using a probe system having probes and probe tests including parametric tests, continuity tests, and a kill die subroutine. Probe tests using the probe program are performed. Die are binned into a first bin (Bin 1 die) for being a good die for all probe tests, or a second bin (Bin 2 die) for failing at least one of continuity tests and parametric tests. The Bin 2 die are divided into a first sub-group that failed the continuity tests and a second sub-group that do not fail the continuity tests. A kill die subroutine is triggered including applying power sufficient to selectively cause damage to the second sub-group of Bin 2 die to generate a continuity failure and thus generate kill die.

公开(公告)号：US10018668B2

公开(公告)日：2018-07-10

申请号：US15713111

申请日：2017-09-22

申请人： Texas Instruments Incorporated

发明人： Hoi Hin Loo ,  Soh Ying Seah

IPC分类号： G01R31/28

CPC分类号： G01R31/2851 ,  G01R31/2853 ,  G01R31/287 ,  G01R31/2894

摘要： A method of testing semiconductor devices includes contacting bond pads coupled to integrated circuitry on a first die of a plurality of interconnected die on a substrate using a probe system having probes and probe tests including parametric tests, continuity tests, and a kill die subroutine. Probe tests using the probe program are performed. Die are binned into a first bin (Bin 1 die) for being a good die for all probe tests, or a second bin (Bin 2 die) for failing at least one of continuity tests and parametric tests. The Bin 2 die are divided into a first sub-group that failed the continuity tests and a second sub-group that do not fail the continuity tests. A kill die subroutine is triggered including applying power sufficient to selectively cause damage to the second sub-group of Bin 2 die to generate a continuity failure and thus generate kill die.