公开(公告)号：US20240297112A1

公开(公告)日：2024-09-05

申请号：US18498188

申请日：2023-10-31

Applicant: Texas Instruments Incorporated

Inventor： Sylvester Ankamah-Kusi ,  Rajen Murugan ,  Harshpreet Bakshi ,  Vivek Sridharan ,  Ruben Rolda

IPC: H01L23/50 ,  H01C1/14 ,  H01C7/00 ,  H01G4/012 ,  H01G4/33 ,  H01L23/552 ,  H01L25/18 ,  H01L27/01

CPC classification number: H01L23/50 ,  H01C1/14 ,  H01C7/003 ,  H01G4/012 ,  H01G4/33 ,  H01L23/552 ,  H01L25/18 ,  H01L27/01

Abstract: A passive component module includes opposite first and second sides, a base extending to the second side, and a redistribution layer structure extending between the base and the first side, the redistribution layer structure including: a passive electronic component with a first component terminal and a second component terminal; a conductive metal trace that forms at least a portion of the passive electronic component; a dielectric layer abutting a portion of the conductive metal trace; a first terminal exposed along the first side and electrically coupled to the first component terminal; and a second terminal spaced apart from the first terminal and exposed along the first side, the second terminal electrically coupled to the second component terminal.