公开(公告)号：US20180316374A1

公开(公告)日：2018-11-01

申请号：US16029432

申请日：2018-07-06

申请人： QUALCOMM Incorporated

发明人： Changhan Yun ,  Chengjie Zuo ,  Mario Velez ,  Niranjan Sunil Mudakatte ,  Shiqun Gu ,  Jonghae Kim ,  David Berdy

IPC分类号： H04B1/16 ,  H01L49/02 ,  H01L23/522 ,  H01L23/00 ,  H01L27/01 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H04B1/00

CPC分类号： H04B1/1638 ,  H01F17/0013 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5223 ,  H01L23/64 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L27/01 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6616 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H04B1/006 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4605 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/097 ,  H05K2201/09827

摘要： In an illustrative example, an apparatus includes a passive-on-glass (POG) device integrated within a glass substrate. The apparatus further includes a semiconductor die integrated within the glass substrate.

公开(公告)号：US20170365519A1

公开(公告)日：2017-12-21

申请号：US15628254

申请日：2017-06-20

申请人： DISCO CORPORATION

发明人： Karl Priewasser ,  Hitoshi Hoshino

IPC分类号： H01L21/8222 ,  B28D5/00 ,  B23K26/364 ,  B23K26/08 ,  H01L27/01 ,  H01L21/76

CPC分类号： H01L21/8222 ,  B23K26/0006 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/083 ,  B23K26/359 ,  B23K26/364 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  B28D5/0011 ,  B28D5/0029 ,  B28D5/0082 ,  H01L21/76 ,  H01L27/01

摘要： A wafer has a device area on one side with a plurality of devices partitioned by a plurality of division lines. Either side of the wafer is attached to an adhesive tape supported by a first annular frame. A modified region is formed in the wafer along the division lines by a laser. The wafer is placed on a support member whose outer diameter is smaller than an inner diameter of the first annular frame. After applying the laser beam, the adhesive tape is expanded thereby dividing the wafer along the division lines. A second annular frame is attached to a portion of the expanded adhesive tape. An inner diameter of the second annular frame is smaller than the outer diameter of the support member and smaller than the inner diameter of the first annular frame.

公开(公告)号：US5414402A

公开(公告)日：1995-05-09

申请号：US152382

申请日：1993-11-16

申请人： Harufumi Mandai ,  Noboru Kato ,  Atsushi Tojyo

发明人： Harufumi Mandai ,  Noboru Kato ,  Atsushi Tojyo

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01L27/01 ,  H05K1/16 ,  H05K1/18 ,  H01F5/02

CPC分类号： H01F17/0013 ,  H01L27/01 ,  H05K1/16 ,  H05K1/181

摘要： A multi-layer substrate which should be used with an inductor. The multi-layer substrate has an internal coil which should be connected with the inductor electrically. The internal coil has such an inductance value that the total inductance of the inductor and the internal coil will be a specified value.

摘要翻译： 应与电感一起使用的多层基板。 多层基板具有应该与电感器电连接的内部线圈。 内部线圈具有这样的电感值，使得电感器和内部线圈的总电感将为规定值。

公开(公告)号：US4900386A

公开(公告)日：1990-02-13

申请号：US196265

申请日：1988-05-20

申请人： Poul Richter-Jorgensen

发明人： Poul Richter-Jorgensen

IPC分类号： B42D15/02 ,  B32B37/00 ,  B42D15/10 ,  B65G47/49 ,  G06K19/07 ,  G06K19/08 ,  G08B13/24 ,  G09F3/00 ,  G11B23/30 ,  H01L21/822 ,  H01L27/01 ,  H01L27/04 ,  H05K1/16 ,  H05K3/04

CPC分类号： B32B37/1207 ,  G08B13/242 ,  G08B13/2437 ,  G08B13/244 ,  G08B13/2442 ,  H01L27/01 ,  H05K3/041 ,  B32B2037/1215 ,  B32B2519/02 ,  Y10T156/1052 ,  Y10T156/107 ,  Y10T156/108 ,  Y10T156/1082 ,  Y10T156/1085 ,  Y10T29/49002

摘要： In order to produce labels incorporating electrical oscillating circuits, certain parts of the circuits are initially punched out of a center area of a metal web covered by an adhesive. Thereafter the center area is covered by an insulating material web for handling stability in order to thereafter punch out the part of the circuit to be located at the outer web area. A covering foil is laminated onto the metal web and the parts of the circuits to be located at the reverse side are applied onto the insulating material web and connected electrically to the remainder of the circuit. This allows an economical and yet precise mass production of labels, for instance for a use in article safeguarding and controlling systems.

摘要翻译： 为了制造包含电振荡电路的标签，电路的某些部分首先从由粘合剂覆盖的金属网的中心区域冲出。 此后，中心区域被绝缘材料网覆盖，以便处理稳定性，以便此后冲出位于外部网区域的电路的一部分。 将覆盖箔层压到金属腹板上，将位于反面的电路部分施加到绝缘材料腹板上并与电路的其余部分电连接。 这允许经济且精确地批量生产标签，例如用于物品保护和控制系统中。

公开(公告)号：US4792790A

公开(公告)日：1988-12-20

申请号：US908901

申请日：1986-09-18

申请人： Max E. Reeb

发明人： Max E. Reeb

IPC分类号： B44F1/12 ,  G06K19/067 ,  G08B13/24 ,  H01L27/01 ,  H03H5/02 ,  H05K1/00 ,  H05K1/16 ,  G08B13/18

CPC分类号： G08B13/242 ,  G06K19/0672 ,  G08B13/2417 ,  G08B13/2431 ,  G08B13/2437 ,  G08B13/244 ,  G08B13/2442 ,  H01L27/01 ,  H03H5/02 ,  H05K1/0393 ,  H05K1/162 ,  H05K1/165 ,  Y10T29/49155

摘要： The identification device in the form of a tag-like construction affixable to an object has at least one inductive element formed of flat conductor paths and a capacitive element formed from overlapping by overlaying conductor path parts and an interposed dielectric, which forms with the inductive element a closed resonant circuit, the conductor paths being arranged in at least two superimposed surfaces by folding together. In this way the conductor path parts forming the capacitive element are superimposed and they are at least partially identical with the conductor path parts forming the inductive element. In the method for the manufacture of the identification arrangement in the form of a tag-like construction affixable to an object, the conductor path constructions are arranged on an endless carrier path and the folding together of the conductor path construction is effected in that a continuously executed folding of the carrier path is carried out along a perforation line or fold-line.

摘要翻译： 标签状结构形式的标识装置具有至少一个可由平面导体路径形成的感应元件和电容元件，该电容元件由叠置的导体路径部分和介入电介质形成，该电介质与电感元件 闭合谐振电路，导体路径通过折叠在一起而布置在至少两个叠加的表面上。 以这种方式，形成电容元件的导体路径部分被重叠，并且它们与形成电感元件的导体路径部分至少部分相同。 在用于制造可贴附于物体的标签状结构形式的识别装置的方法中，导体路径结构布置在环形载体路径上，并且导体路径构造的折叠一起实现为连续地 沿穿孔线或折线进行载体路径的执行折叠。

公开(公告)号：US4745401A

公开(公告)日：1988-05-17

申请号：US773593

申请日：1985-09-09

申请人： Samuel Montean

发明人： Samuel Montean

IPC分类号： G01V15/00 ,  G08B13/24 ,  H01L27/01 ,  G08B13/18

CPC分类号： G08B13/242 ,  G01V15/00 ,  G08B13/2437 ,  G08B13/2442 ,  G08B13/2457 ,  H01L27/01

摘要： A marker for use in radio frequency electronic article surveillance systems where the marker contains an inductive-capacitive resonant circuit and is made reversibly deactivatable and reactivatable by the addition of a piece of magnetic material and means, such as a piece of permanently magnetizable material, for biasing the first material to prevent alternating fields induced therein from changing the magnetic state of that material, thereby preventing hysteresis losses from causing a lowering of the Q of the resonant circuit below the point of detection.

摘要翻译： 一种用于射频电子物品监视系统的标记，其中标记包含电感 - 电容谐振电路，并且通过添加一块磁性材料和诸如一片永久可磁化材料的装置可逆地失活并可再生，用于 偏置第一材料以防止其中感应的交变场改变该材料的磁状态，从而防止磁滞损耗导致谐振电路的Q降低到低于检测点。

公开(公告)号：US4658264A

公开(公告)日：1987-04-14

申请号：US669752

申请日：1984-11-09

申请人： Dennis L. Baker

发明人： Dennis L. Baker

IPC分类号： H01G4/40 ,  G08B13/24 ,  H01F27/00 ,  H01L27/01 ,  H01Q1/36 ,  H03H7/01

CPC分类号： G08B13/242 ,  G08B13/244 ,  G08B13/2442 ,  H01L27/01

摘要： A tuned resonant circuit including inductive and capacitive components useful as a marker in electronic article surveillance systems, comprising a laminate of a dielectric sheet having a conductive layer on one side configured to form at least one multi-turn inductive spiral. The sheet is folded back upon itself at a fold line which is precisely defined by spaced apart areas of the conductive layer such that desired portions of the layer become precisely and uniformly juxtaposed.

摘要翻译： 一种调谐谐振电路，包括用作电子物品监视系统中的标记的感应和电容部件，包括在一侧上具有导电层的电介质片的层叠体，其被配置成形成至少一个多回转感应螺旋。 片材在折叠线上折叠，折叠线由导电层的间隔开的区域精确地限定，使得层的期望部分变得精确和均匀地并置。

公开(公告)号：US4596762A

公开(公告)日：1986-06-24

申请号：US509433

申请日：1983-06-02

申请人： Heiko Gruner

发明人： Heiko Gruner

IPC分类号： H01L27/01 ,  H05K1/09 ,  H05K1/16 ,  H05K3/06 ,  H05K3/24 ,  H05K3/38 ,  G03C5/00

CPC分类号： H05K3/24 ,  H01L27/01 ,  H05K1/167 ,  H05K2201/0317 ,  H05K2203/0361 ,  H05K2203/044 ,  H05K2203/0505 ,  H05K3/064 ,  H05K3/388

摘要： An electronic thin-film circuit having a substrate plate comprising an insulating material and having a resistance film partially covering the substrate plate is proposed. The resistance film forms a first pattern and a second pattern. The first pattern defines tracks and/or connection contacts, while the second pattern defines circuit elements of the electronic thin-film circuit. A metal film which is capable of being soldered and of being reinforced by electroplating is disposed above the resistance film in the vicinity of the first pattern. Inside the first pattern, a soft-solder film is applied to parts of the metal film which is capable of being soldered and of being reinforced by electroplating, in order to form tracks and/or connection contacts which are reinforced with soft solder. A gold film is applied to other parts, not coated with soft solder, of the metal film which is capable of being soldered and of being reinforced by electroplating, inside the first pattern, in order to form tracks and/or connection contacts which are reinforced with gold. A bonding wire is secured to the gold film.

摘要翻译： PCT No.PCT / DE82 / 00195 Sec。 371日期1983年6月2日 102（e）日期1983年6月2日PCT提交1982年10月5日PCT公布。 公开号WO83 / 01344 日本1983年4月14日，提出了一种电子薄膜电路，其具有包含绝缘材料并具有部分覆盖基板的电阻膜的基板。 电阻膜形成第一图案和第二图案。 第一图案定义轨道和/或连接触点，而第二图案定义电子薄膜电路的电路元件。 能够被焊接并通过电镀加强的金属膜设置在第一图案附近的电阻膜的上方。 在第一图案内部，将软焊料膜施加到能够被焊接并通过电镀加强的金属膜的部分，以形成用软焊料增强的轨道和/或连接触点。 将金膜施加到金属膜的其他部分（未涂覆软焊料）上，该金属膜能够被焊接并且通过电镀在第一图案内部被加强，以形成加强的轨道和/或连接触点 与金。 接合线固定在金膜上。

公开(公告)号：US4443830A

公开(公告)日：1984-04-17

申请号：US480336

申请日：1983-03-30

申请人： Toshimi Kaneko ,  Yukio Hata

发明人： Toshimi Kaneko ,  Yukio Hata

IPC分类号： H01T4/10 ,  H01G2/14 ,  H01G4/40 ,  H01L27/01 ,  H01G1/11 ,  H01L27/02

CPC分类号： H01L27/01 ,  H01G4/40 ,  Y10S257/916

摘要： The disclosure is directed to an improved CR composite part provided with a discharge gap, in which discharge electrodes are provided on opposite surfaces of a substrate formed with a CR composite circuit, while an opening is provided between confronting forward ends of the discharge electrodes on the respective surfaces of the substrate, so that electrical discharge between both of the discharge electrodes is effected through the space for the opening so as to prevent adhesion of foreign matters between the discharge electrodes and also, to effectively obstruct formation of undesirable stray capacitance for stable discharging characteristics.

摘要翻译： 本发明涉及一种具有放电间隙的改进的CR复合部件，其中放电电极设置在形成有CR复合电路的基板的相对表面上，同时在放电电极的相对的前端之间设置开口 使得放电电极之间的放电通过开口的空间进行，以防止异物在放电电极之间的粘附，并且有效地阻止形成不期望的杂散电容以实现稳定的放电 特点

公开(公告)号：US20180090475A1

公开(公告)日：2018-03-29

申请号：US15275068

申请日：2016-09-23

申请人： QUALCOMM Incorporated

发明人： Chengjie ZUO ,  Jonghae KIM ,  David Francis BERDY ,  Changhan Hobie YUN ,  Niranjan Sunil MUDAKATTE ,  Mario Francisco VELEZ ,  Shiqun GU

IPC分类号： H01L27/01 ,  H01L23/31 ,  H01L23/552 ,  H01L23/528 ,  H01L23/498 ,  H01L21/768 ,  H01L21/56 ,  H01L23/522 ,  H03H7/01 ,  H03H7/46 ,  H04B1/00

CPC分类号： H01L27/01 ,  H01L21/56 ,  H01L21/76885 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49805 ,  H01L23/5226 ,  H01L23/5286 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19011 ,  H01L2924/3025 ,  H03H7/0115 ,  H03H7/468 ,  H04B1/0057 ,  H01L2924/014 ,  H01L2924/00014

摘要： An integrated circuit (IC) device includes a die having an integrated passive device (IPD) layer. The integrated circuit device also includes a substrate supporting the die, a molding compound surrounding the die. The integrated circuit device further includes a backside conductive layer on a surface of the die that is distal from the IPD layer. The integrated circuit device also includes vias coupling the backside conductive layer to a ground plane through the molding compound.