公开(公告)号：US08847349B2

公开(公告)日：2014-09-30

申请号：US13723874

申请日：2012-12-21

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Screenivasan K. Koduri

IPC: H01L29/00 ,  H01L49/02

CPC classification number: H01L24/17 ,  H01L23/28 ,  H01L23/5226 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L28/00 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract translation: 一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。