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公开(公告)号：US10994988B2
公开(公告)日：2021-05-04
申请号：US16293330
申请日：2019-03-05
Applicant: THALES
Inventor： Bertrand Leverrier , Claude Sarno , Claude Rougeot , Romain Hodot
Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.
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2.发明申请公开(公告)号：US20190276307A1
公开(公告)日：2019-09-12
申请号：US16293330
申请日：2019-03-05
Applicant: Thales
Inventor： Bertrand LEVERRIER , Claude Sarno , Claude Rougeot , Romain Hodot
Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane.The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.
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公开(公告)号：US09574879B2
公开(公告)日：2017-02-21
申请号：US14750862
申请日：2015-06-25
Applicant: THALES
Inventor： Bernard Chaumet , Fabien Filhol , Claude Rougeot , Bertrand Leverrier
IPC: G01C19/56 , G01C19/5747 , G01C19/574
CPC classification number: G01C19/5747 , G01C19/574
Abstract: A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.
Abstract translation: 提供振动惯性传感器，微机加工在平面薄晶片中，允许测量角位置或角速度。 该传感器包括由X和Y中具有相同刚度的弹簧悬挂的两个振动块，并且通过X和Y中相同的刚度弹簧和至少一个设置在至少一个质量块上的激励换能器和检测换能器联接在一起。 由振动块和固定到该块的换能器部分组成的移动组件相对于对称轴OX和相对于对称轴线OY具有大致对称的结构。
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