公开(公告)号：US12196576B2

公开(公告)日：2025-01-14

申请号：US18012963

申请日：2021-06-18

Applicant: THALES

Inventor： Nicolas Vercier ,  Bernard Chaumet ,  Bertrand Leverrier

IPC: G01C25/00 ,  G01C19/574

Abstract: A method for calibrating an inertial angular sensor includes: for at least two electrical angles of the vibration wave, applying, via each of the three trim controls, a sinusoidal stiffness disturbance having a disturbance frequency, and for each applied disturbance, determining and storing an estimated excitation force to be applied to the resonator in the presence of the stiffness disturbance, on the basis of excitation controls determined by the servo controls; determining, on the basis of the three estimated excitation forces, three 2×2 matrices, being representative of the response of the gyrometer to the stiffness disturbance; determining and storing an estimated inverse excitation matrix and an estimated inverse detection matrix on the basis of the three matrices, an excitation matrix and a detection matrix being respectively representative of effects of the excitation chain and of effect of the detection chain of the sensor.

公开(公告)号：US09731958B2

公开(公告)日：2017-08-15

申请号：US15273423

申请日：2016-09-22

Applicant: THALES

Inventor： Fabien Filhol ,  Pierre-Olivier Lefort ,  Bertrand Leverrier ,  Régis Quer ,  Bernard Chaumet

IPC: B81B7/00 ,  B81C3/00 ,  B81C1/00 ,  H01L23/10

CPC classification number: B81B7/0016 ,  B81B7/0048 ,  B81B7/0051 ,  B81B2203/0307 ,  B81C1/00269 ,  B81C3/001 ,  B81C2201/019 ,  H01L23/10

Abstract: A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

公开(公告)号：US09574879B2

公开(公告)日：2017-02-21

申请号：US14750862

申请日：2015-06-25

Applicant: THALES

Inventor： Bernard Chaumet ,  Fabien Filhol ,  Claude Rougeot ,  Bertrand Leverrier

IPC: G01C19/56 ,  G01C19/5747 ,  G01C19/574

CPC classification number: G01C19/5747 ,  G01C19/574

Abstract: A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.

Abstract translation: 提供振动惯性传感器，微机加工在平面薄晶片中，允许测量角位置或角速度。 该传感器包括由X和Y中具有相同刚度的弹簧悬挂的两个振动块，并且通过X和Y中相同的刚度弹簧和至少一个设置在至少一个质量块上的激励换能器和检测换能器联接在一起。 由振动块和固定到该块的换能器部分组成的移动组件相对于对称轴OX和相对于对称轴线OY具有大致对称的结构。

公开(公告)号：US10994988B2

公开(公告)日：2021-05-04

申请号：US16293330

申请日：2019-03-05

Applicant: THALES

Inventor： Bertrand Leverrier ,  Claude Sarno ,  Claude Rougeot ,  Romain Hodot

IPC: B81B7/02 ,  B81B7/00

Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.