ELECTRONIC SYSTEM COMPRISING A MICROELECTROMECHANICAL SYSTEM AND A BOX ENCAPSULATING THIS MICROELECTROMECHANICAL SYSTEM

    公开(公告)号:US20190276307A1

    公开(公告)日:2019-09-12

    申请号:US16293330

    申请日:2019-03-05

    Applicant: Thales

    Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane.The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

    Rack intended to equip an aeronautical platform
    6.
    发明授权
    Rack intended to equip an aeronautical platform 有权
    机架旨在装备航空平台

    公开(公告)号:US09253918B2

    公开(公告)日:2016-02-02

    申请号:US14227184

    申请日:2014-03-27

    Applicant: THALES

    Abstract: A rack for an aeronautical platform comprising two parallel shelves positioned between a front face and a rear face of the platform, the rack being inserted into the platform by translation from the front face to the rear face the rack containing electronic equipment extending primarily in a plane, the electronic equipment being positioned in a useful compartment of the rack and cooled by forced convection. The electronic equipment is positioned in such a way that its main plane is parallel to the shelves. The rack comprises means for guiding an air flow used for the cooling of the electronic equipment item, the air flow penetrating into the useful compartment parallel to the plane of the electronic equipment item and at right angles to the direction of insertion of the rack into the platform.

    Abstract translation: 一种用于航空平台的机架,包括位于所述平台的前表面和后表面之间的两个平行架,所述齿条通过从所述前表面到所述后表面平移而插入所述平台中,所述机架包含主要在平面中延伸的电子设备 ,电子设备被定位在机架的有用隔间中并被强制对流冷却。 电子设备的定位方式是使其主平面平行于货架。 机架包括用于引导用于电子设备项目的冷却的空气流的装置,空气流与电子设备项目的平面平行地插入有用室,并且与支架的插入方向成直角。 平台。

    THERMAL REGULATION SYSTEM FOR AT LEAST ONE ELECTRONIC MODULE EMBEDDED ONBOARD AN AIRCRAFT
    7.
    发明申请
    THERMAL REGULATION SYSTEM FOR AT LEAST ONE ELECTRONIC MODULE EMBEDDED ONBOARD AN AIRCRAFT 审中-公开
    用于嵌入式飞机的最小一个电子模块的热调节系统

    公开(公告)号:US20150241144A1

    公开(公告)日:2015-08-27

    申请号:US14625480

    申请日:2015-02-18

    Applicant: THALES

    CPC classification number: F28F9/007 F28D1/02 H05K7/20645 H05K7/20681

    Abstract: Heat regulation system (1) for at least one equipment item (2) embedded onboard an aircraft, includes a thermal regulation circuit (5) connected to the equipment item(s) (2). The thermal regulation circuit (5) includes a modular thermal regulation device (6) adapted to receive a modifiable number of thermal regulation modules (8).

    Abstract translation: 用于至少一个嵌入在飞行器上的设备项目(2)的热调节系统(1)包括连接到设备项目(2)的热调节电路(5)。 热调节电路(5)包括适于接收可修改数量的热调节模块(8)的模块化热调节装置(6)。

    Thermal control device of a component, associated electronic system and platform

    公开(公告)号:US11300332B2

    公开(公告)日:2022-04-12

    申请号:US16232779

    申请日:2018-12-26

    Applicant: THALES

    Abstract: The present invention relates to a thermal control device of a component, the control device including: a power source, a converter able to convert a temperature variation into a resistance variation, and a cooling module including two faces, a first face at a first temperature and a second face at a second temperature, the difference between the first temperature and the second temperature depending on the current supplying the cooling module, the first face being in, contact with the component, the cooling module, the converter and the power source being arranged electrically so that the current supplying the converter decreases with a temperature increase and the current supplying the cooling module remains constant.

    Electronic system comprising a microelectromechanical system and a box encapsulating this microelectromechanical system

    公开(公告)号:US10994988B2

    公开(公告)日:2021-05-04

    申请号:US16293330

    申请日:2019-03-05

    Applicant: THALES

    Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

Patent Agency Ranking