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1.发明申请公开(公告)号：US20230091655A1
公开(公告)日：2023-03-23
申请号：US17481184
申请日：2021-09-21
Applicant: The Aerospace Corporation
Inventor： Geena L. FERRELLI , Hyun I. KIM , Rafael J. ZALDIVAR
Abstract: Processes for rapidly and accurately measuring the coefficient of moisture expansion for materials, such as adhesives, are disclosed. A replication technique may be used to manufacture highly flat and smooth adhesive samples. Moisture is introduced in a controlled humidity atmosphere, distortion is monitored with an accurate laser interferometer (e.g., ˜1 nanometer (nm) accuracy), and measurements are correlated with moisture content change. Such processes decrease sample size by three orders of magnitude as compared with conventional techniques and have a smaller adhesive mass requirement, which enables measurement of expensive microelectronic adhesives that were previously cost-prohibitive to measure. Also, thinner films allow CME measurements of ultraviolet (UV) cured adhesives that would otherwise have depth of penetration issues. Furthermore, saturation occurs quickly, allowing pre-stabilization at room temperature, which enabled parametric studies as a function of processing or cure state. Additionally, testing occurs within hours versus months, enabling short lead times for root-cause investigations.
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公开(公告)号：US20240368429A1
公开(公告)日：2024-11-07
申请号：US18310840
申请日：2023-05-02
Applicant: The Aerospace Corporation
Inventor： Geena L. FERRELLI , Hyun I. KIM , Rafael J. ZALDIVAR
Abstract: Low stress and tailorable stress adhesives for bonding of sensitive components and a process for using the same are disclosed. The residual curing stress is tailorable based on adherends and with material properties that minimize environmentally induced thermal and hygroscopic distortions. Degraded performance of sensitive optical assemblies may be reduced or eliminated during bonding processes due to residual stress formation of adhesives. The adhesives are characterized by a second mechanism of stress formation other than the tensile stress from shrinkage during curing. Specifically, the adhesive is characterized by a cure gradient through its thickness, causing diffusion of uncured monomer into the more highly crosslinked region. This diffusion causes a compressive stress to form and offset the tensile cure shrinkage stress. The relative amounts of shrinkage and swelling that occur can be tailored to control residual stress formation, and ultimately, to generate a zero-stress bonding adhesive.
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公开(公告)号：US20180056327A1
公开(公告)日：2018-03-01
申请号：US15250823
申请日：2016-08-29
Applicant: The Aerospace Corporation
Inventor： Rafael J. ZALDIVAR , Geena L. FERRELLI , Hyun I. KIM , Dhruv N. PATEL
CPC classification number: B05D3/06 , B05C9/02 , B05D3/145 , B29C70/00 , G02B5/0808
Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.
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Patent Agency Ranking
公开(公告)号：US20240183805A1
公开(公告)日：2024-06-06
申请号：US18061908
申请日：2022-12-05
Applicant: The Aerospace Corporation
Inventor： Rafael J. ZALDIVAR , Hyun I. KIM , Geena L. FERRELLI
IPC: G01N23/2251 , G01N1/32 , G01N33/44 , G01Q60/24
CPC classification number: G01N23/2251 , G01N1/32 , G01N33/442 , G01Q60/24 , G01N2223/07 , G01N2223/418 , G01N2223/507
Abstract: Evaluating the quality of cyanate ester matrix resin material includes inserting a small piece of a deposit extracted from a composite laminate into an epoxy for cross-sectional analysis, and performing cross-sectional polishing on the small piece of the deposit. Evaluating the quality of the cyanate ester matrix resin material also includes performing resolution imaging to study a plurality of plies in the small piece of the deposit to evaluate each ply without causing destruction to each of the plurality of plies.
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公开(公告)号：US20210396638A1
公开(公告)日：2021-12-23
申请号：US17462986
申请日：2021-08-31
Applicant: The Aerospace Corporation
Inventor： Rafael J. ZALDIVAR , Geena L. FERRELLI , Hyun I. KIM
Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.
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公开(公告)号：US20210349401A1
公开(公告)日：2021-11-11
申请号：US17379753
申请日：2021-07-19
Applicant: The Aerospace Corporation
Inventor： Rafael J. ZALDIVAR , Geena L. FERRELLI , Hyun I. KIM
IPC: G03F7/20
Abstract: An assembly comprises an exposure chamber configured to receive a structure and identify at least one portion of the structure for further processing. The exposure chamber is further configured to expose the at least one portion of the structure to radiation such that a high cure state and a low residual stress are achieved for the structure. A dosage level of the radiation is determined based, at least in part, on the composition of the structure.
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7.发明申请公开(公告)号：US20200025663A1
公开(公告)日：2020-01-23
申请号：US16042997
申请日：2018-07-23
Applicant: The Aerospace Corporation
Inventor： Rafael J. ZALDIVAR , Geena L. FERRELLI , Hyun I. KIM
Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.
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公开(公告)号：US20180099310A1
公开(公告)日：2018-04-12
申请号：US15846027
申请日：2017-12-18
Applicant: The Aerospace Corporation
Inventor： Rafael J. ZALDIVAR , Geena L. FERRELLI , Hyun I. KIM , Dhruv N. PATEL
CPC classification number: B05D3/06 , B05C9/02 , B05D3/145 , B29C70/00 , G02B5/0808
Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.
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