公开(公告)号：US20230225082A1

公开(公告)日：2023-07-13

申请号：US17575071

申请日：2022-01-13

申请人： Toyota Motor Engineering & Manufacturing North America, Inc. ,  The Board of Trustees of the Leland Stanford Junior University ,  The Regents of the University of California, Merced ,  Alliance for Sustainable Energy, LLC

发明人： Chi Zhang ,  Qianying Wu ,  Muhammad Shattique ,  Neda Seyedhassantehrani ,  Souvik Roy ,  James Palko ,  Sreekant Narumanchi ,  Bidzina Kekelia ,  Sougata Hazra ,  Kenneth E. Goodson ,  Roman Giglio ,  Ercan M. Dede ,  Mehdi Asheghi

IPC分类号： H05K7/20

CPC分类号： H05K7/20327 ,  H05K7/20336

摘要： A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

公开(公告)号：US20230197448A1

公开(公告)日：2023-06-22

申请号：US18084303

申请日：2022-12-19

申请人： The Board of Trustees of the Leland Stanford Junior University

发明人： Chi Zhang ,  Sougata Hazra ,  Qianying Wu ,  Mehdi Asheghi ,  Kenneth E. Goodson ,  Ercan Dede ,  James Palko ,  Sreekant Narumanchi

IPC分类号： H01L21/027 ,  G03F7/20 ,  H01L21/311

CPC分类号： H01L21/0274 ,  G03F7/20 ,  H01L21/31144

摘要： We provide a novel cleanroom-based process flow that allows for easy creation of multi-level, hierarchical 3D structures in a substrate. This is achieved by introducing an ultra-thin sacrificial hardmask layer on the substrate which is first 3D patterned via multiple rounds of lithography. This 3D pattern is then scaled vertically by a factor of 200 - 300 and transferred to the substrate underneath via a single shot deep etching step. This method is also easily characterizable - using features of different topographies and dimensions, the etch rates and selectivities were quantified; this characterization information was later used while fabricating specific target structures.

公开(公告)号：US20230380106A1

公开(公告)日：2023-11-23

申请号：US17748429

申请日：2022-05-19

申请人： Toyota Motor Engineering & Manufacturing North America Inc. ,  The Board of Trustees of the Leland Stanford Junior University ,  The Regents of the University of California, Merced ,  Alliance for Sustainable Energy, LLC

发明人： Sougata Hazra ,  Chi Zhang ,  Mehdi Asheghi ,  Kenneth E. Goodson ,  Ercan M. Dede ,  James Palko ,  Sreekant Narumanchi

IPC分类号： H05K7/20 ,  F28F9/22

CPC分类号： H05K7/20272 ,  H05K7/20254 ,  F28F9/22

摘要： Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.

公开(公告)号：US20230314090A1

公开(公告)日：2023-10-05

申请号：US18129657

申请日：2023-03-31

申请人： The Board of Trustees of the Leland Stanford Junior University

发明人： Sougata Hazra ,  Mehdi Asheghi ,  Kenneth E. Goodson ,  Chi Zhang

IPC分类号： F28D15/04 ,  F28F3/02

CPC分类号： F28D15/046 ,  F28F3/022 ,  F28D2015/0225

摘要： Improved vapor chambers are provided using monolithic wick structures having deep features (≥150 um) and two or more different feature heights above the substrate. Such monolithic multi-level wick structures provide improved performance in vapor chambers by alleviating the tradeoff between fluid transport (which favors tall pin-fins) and heat transfer (which favors short pin-fins).

公开(公告)号：US11729951B2

公开(公告)日：2023-08-15

申请号：US17575071

申请日：2022-01-13

申请人： Toyota Motor Engineering & Manufacturing North America, Inc. ,  The Board of Trustees of the Leland Stanford Junior University ,  The Regents of the University of California, Merced ,  Alliance for Sustainable Energy, LLC

发明人： Chi Zhang ,  Qianying Wu ,  Muhammad Shattique ,  Neda Seyedhassantehrani ,  Souvik Roy ,  James Palko ,  Sreekant Narumanchi ,  Bidzina Kekelia ,  Sougata Hazra ,  Kenneth E. Goodson ,  Roman Giglio ,  Ercan M. Dede ,  Mehdi Asheghi

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC分类号： H05K7/20327 ,  H05K7/20336

摘要： A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.