公开(公告)号：US20230262899A1

公开(公告)日：2023-08-17

申请号：US18082924

申请日：2022-12-16

申请人： The Johns Hopkins University

发明人： Konstantinos Gerasopoulos ,  Jason E. Tiffany ,  Seppo J. Lehtonen ,  Vanessa O. Rojas ,  Spencer A. Langevin ,  Bing Tan

IPC分类号： H05K1/18 ,  H01M10/04 ,  H01M10/6569 ,  H01M50/519

CPC分类号： H05K1/181 ,  H01M10/0431 ,  H01M10/0468 ,  H01M10/6569 ,  H01M50/519 ,  H01M50/105 ,  H01M2300/0082 ,  H05K2201/10037 ,  H05K2201/10568 ,  H05K2201/10628

摘要： An apparatus for mounting on a circuit board is provided. The apparatus may include a circuit board mount packaging and a battery. The circuit board mount packaging may include a cavity, a first internal lead, and a second internal lead. The first internal lead may be connect to a first external pin and the second internal lead may be connected to a second external pin. The battery may be disposed within the cavity of the circuit board mount packaging. The battery may comprise an anode and a cathode. The anode may be wire bond connected to the first internal lead and the cathode may be wire bond connected to the second internal lead.