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公开(公告)号:US11936082B2
公开(公告)日:2024-03-19
申请号:US17006761
申请日:2020-08-28
CPC分类号: H01P1/15 , G02F1/011 , G02F1/0338 , G02F1/21 , H01P3/00 , H01P3/003 , H01P3/16 , H01P5/00 , G02F1/212 , G02F2201/16 , G02F2203/055
摘要: Microwave photonic devices use light to carry and process microwave signals over a photonic link. Light can be used as a stimulus to microwave devices that directly control microwave signals. Previous optically controlled devices suffer from large footprint, high optical power level required for switching, lack of scalability and complex integration requirements, restricting their implementation in practical microwave systems. Disclosed are monolithic optically reconfigurable integrated microwave switches (MORIMSs) built on a CMOS compatible silicon photonic chip. The disclosed scalable micrometer-scale switches provide higher switching efficiency and operate using optical power that is orders of magnitude lower than previous devices. The disclosed devices and techniques provide examples of silicon photonic platforms integrating microwave circuitry.
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2.
公开(公告)号:US20210063838A1
公开(公告)日:2021-03-04
申请号:US17006761
申请日:2020-08-28
摘要: Microwave photonic devices use light to carry and process microwave signals over a photonic link. Light can be used as a stimulus to microwave devices that directly control microwave signals. Previous optically controlled devices suffer from large footprint, high optical power level required for switching, lack of scalability and complex integration requirements, restricting their implementation in practical microwave systems. Disclosed are monolithic optically reconfigurable integrated microwave switches (MORIMSs) built on a CMOS compatible silicon photonic chip. The disclosed scalable micrometer-scale switches provide higher switching efficiency and operate using optical power that is orders of magnitude lower than previous devices. The disclosed devices and techniques provide examples of silicon photonic platforms integrating microwave circuitry.
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