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1.发明申请METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC MATERIALS 有权在不使用有毒物质的情况下获得黄疸黄金合金沉积的方法公开(公告)号：US20150027898A1
公开(公告)日：2015-01-29
申请号：US14452364
申请日：2014-08-05
IPC分类号： C25D3/62
摘要： The invention concerns the field of galvanic depositions and relates to a method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide. According to the invention, the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.
摘要翻译： 本发明涉及电沉积领域，涉及一种将金合金浸入浸入包含碱金属氰化物形式的金属金，有机金属化合物，润湿剂，多价螯合剂和游离氰化物的浴中的电镀锌的方法。 根据本发明，合金金属是双铜和氰化钾形式的铜，氰化物形式的银，允许在电极上沉积镜面明亮的黄金合金。
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2.发明授权Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials 有权通过电铸成形术获得黄金合金沉积而不使用有毒物质的方法公开(公告)号：US09567684B2
公开(公告)日：2017-02-14
申请号：US14452364
申请日：2014-08-05
摘要： The invention concerns the field of galvanic depositions and relates to a method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide. According to the invention, the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.
摘要翻译： 本发明涉及电沉积领域，涉及一种将金合金浸入浸入包含碱金属氰化物形式的金属金，有机金属化合物，润湿剂，多价螯合剂和游离氰化物的浴中的电镀锌的方法。 根据本发明，合金金属是双铜和氰化钾形式的铜，氰化物形式的银，允许在电极上沉积镜面明亮的黄金合金。
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公开(公告)号：US10793961B2
公开(公告)日：2020-10-06
申请号：US16038662
申请日：2018-07-18
摘要： A method for the galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including gold metal, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, the alloy metals being copper metal and silver metal allowing a mirror-bright yellow gold alloy to be deposited on the electrode characterized in that the bath respects a proportion of 21.53% gold, 78.31% copper and 0.16% silver.
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