公开(公告)号：US5155578A

公开(公告)日：1992-10-13

申请号：US691764

申请日：1991-04-26

申请人： Thiam B. Lim ,  Soon C. Lian

发明人： Thiam B. Lim ,  Soon C. Lian

IPC分类号： H01L21/56 ,  H01L23/49 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/50 ,  H01L21/565 ,  H01L23/4951 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181

摘要： The degree of wire sweep and wire clearance over the buss bars in the 16 Mega Bit LOC package is found to be dependent on the angle of the bond wires. A positive wire angle range of 5 to 15 degrees is recommended for minimum wire sweep and maximum wire clearance over the buss bars. This is so because they offer the least resistance to the flow of the mold compound during transfer molding. A staggered gating system ensures that the wire angles in all cavities are positive with respect to the gate. This invention is also applicable to conventional packages.

摘要翻译： 发现16兆位LOC封装中的汇流条上的电线扫掠程度和电线间隙取决于接合线的角度。 推荐使用5至15度的正线角度范围进行最小线扫和母线上的最大线间隙。 这是因为它们在传递模塑期间对模具化合物的流动提供最小的阻力。 交错门控系统确保所有腔中的线角相对于门是正的。 本发明也适用于常规包装。