公开(公告)号：US5155578A

公开(公告)日：1992-10-13

申请号：US691764

申请日：1991-04-26

申请人： Thiam B. Lim ,  Soon C. Lian

发明人： Thiam B. Lim ,  Soon C. Lian

IPC分类号： H01L21/56 ,  H01L23/49 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/50 ,  H01L21/565 ,  H01L23/4951 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181

摘要： The degree of wire sweep and wire clearance over the buss bars in the 16 Mega Bit LOC package is found to be dependent on the angle of the bond wires. A positive wire angle range of 5 to 15 degrees is recommended for minimum wire sweep and maximum wire clearance over the buss bars. This is so because they offer the least resistance to the flow of the mold compound during transfer molding. A staggered gating system ensures that the wire angles in all cavities are positive with respect to the gate. This invention is also applicable to conventional packages.

摘要翻译： 发现16兆位LOC封装中的汇流条上的电线扫掠程度和电线间隙取决于接合线的角度。 推荐使用5至15度的正线角度范围进行最小线扫和母线上的最大线间隙。 这是因为它们在传递模塑期间对模具化合物的流动提供最小的阻力。 交错门控系统确保所有腔中的线角相对于门是正的。 本发明也适用于常规包装。

公开(公告)号：US5229329A

公开(公告)日：1993-07-20

申请号：US933863

申请日：1992-08-21

申请人： Tai C. Chai ,  Boon Q. Seow ,  Karta W. Tjandra ,  Thiam B. Lim ,  Tadashi Saitoh

发明人： Tai C. Chai ,  Boon Q. Seow ,  Karta W. Tjandra ,  Thiam B. Lim ,  Tadashi Saitoh

IPC分类号： H01L23/495

CPC分类号： H01L24/48 ,  H01L23/4951 ,  H01L23/49558 ,  H01L24/05 ,  H01L24/06 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4899 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20752

摘要： An insulated lead frame for a semiconductor packaged device and a method of manufacturing both the insulated lead frame and the semiconductor packaged device are disclosed. The insulated lead frame has a first plurality of lead fingers and a second plurality of lead fingers. It also has the face of a power supply bus lying between the pluralities of lead fingers. An insulator covers the face of the power supply bus. An example of an insulator is a cured liquid polyimide. In a semiconductor packaged device using a lead on chip lead frame, such as a dynamic random access memory, DRAM, wire bonding that connects the power supply busses of the lead frame may first occur and the liquid insulator may afterwards be applied to the power supply busses. Alternatively, by knowing where the wire bonds will bond to the power supply busses, the liquid insulator may be applied to the power supply busses before wire bonding occurs. The bonding spots on the power supply busses are not covered with the liquid insulator. Both methods serve to reduce the possibility of shorting between the power supply busses and the crossing wire bonds that connect the lead fingers of the lead frame to the bonding pads of the integrated circuit.

摘要翻译： 公开了一种用于半导体封装器件的绝缘引线框架和制造绝缘引线框架和半导体封装器件的方法。 绝缘引线框具有第一多个引线指和第二多个引线指。 它还具有位于多个引线指之间的电源总线的面。 绝缘体覆盖电源总线的表面。 绝缘体的实例是固化的液体聚酰亚胺。 在使用诸如动态随机存取存储器之类的片上引线框架的半导体封装器件中，可以首先发生连接引线框的电源总线的引线接合，然后将液体绝缘体施加到电源 公共汽车 或者，通过知道线接合到电源总线的位置，在引线接合发生之前，可以将液体绝缘体施加到电源总线。 电源总线上的接合点不被液体绝缘体覆盖。 这两种方法都有助于降低电源总线与将引线框架的引线连接到集成电路的焊盘之间的交叉引线接合的短路的可能性。

公开(公告)号：US5206536A

公开(公告)日：1993-04-27

申请号：US644805

申请日：1991-01-23

申请人： Thiam B. Lim

发明人： Thiam B. Lim

IPC分类号： H01L23/495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49531 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/20752

摘要： A comb insert for semiconductor packaged devices is disclosed. The comb is conductive and thus useful to function as a power supply bus in transferring power to the semiconductor die. A base, formed out of a conductive material, resides underneath the lead fingers of the semiconductor packaged device, electrically isolated from the lead fingers. The base has teeth extending from it, also formed out of the conductive material, that reside between the lead fingers of the semiconductor packaged device. Some of the teeth are electrically connected to the lead fingers for receiving external power. Some of the teeth are electrically connected to the bonding pads of the semiconductor die. Power is transferred from the lead fingers for receiving it, through the teeth electrically connected to these lead fingers, through the base, through the teeth electrically connected to the bonding pads, and to the semiconductor die. Utilizing the comb insert in a lead on chip lead frame semiconductor packaged device solves the problem of wire bond shorting to the power supply bus portions of the lead frame.

摘要翻译： 公开了一种用于半导体封装器件的梳子插入件。 梳子是导电的，因此可用作将功率传递到半导体管芯的电源总线。 由导电材料形成的基座位于半导体封装器件的引线指的下面，与引线指电绝缘。 基部具有从其延伸的齿，其也由导电材料形成，其位于半导体封装装置的引线指之间。 一些齿电连接到引线指以接收外部电力。 一些齿电连接到半导体管芯的接合焊盘。 电力从引线指转移以通过与这些引线指电气连接的齿通过基座，电连接到接合焊盘的齿和半导体管芯而被接收。 利用梳形插入件在片上引线框架半导体封装器件中解决了引线框架的电源母线部分引线接合短路的问题。

公开(公告)号：US5434106A

公开(公告)日：1995-07-18

申请号：US197027

申请日：1994-02-16

申请人： Thiam B. Lim ,  Tadashi Saitoh ,  Boon Q. Seow

发明人： Thiam B. Lim ,  Tadashi Saitoh ,  Boon Q. Seow

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L21/60

CPC分类号： H01L23/4951 ,  H01L23/3135 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92147 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121

摘要： A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a polyimide coating on its backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The polyimide coating on the backside of the integrated circuit helps to reduce package cracking arising from mounting the device to a printed circuit board by relflow solder.

摘要翻译： 公开了一种半导体封装器件。 在一个实施例中，通过其有源面连接到具有引线引脚的引线上引线框架是集成电路。 集成电路的背面有一个聚酰亚胺涂层。 封装材料围绕集成电路和引线框架引线框架，使得引线管暴露。 集成电路背面的聚酰亚胺涂层有助于减少通过回流焊接将器件安装到印刷电路板上的封装破裂。

公开(公告)号：US4745787A

公开(公告)日：1988-05-24

申请号：US16485

申请日：1987-02-17

申请人： Dennis H. Sansome ,  Thiam B. Lim

发明人： Dennis H. Sansome ,  Thiam B. Lim

IPC分类号： B21C1/24 ,  B21C3/16 ,  B21C9/00

CPC分类号： B21C9/00 ,  B21C1/24 ,  B21C3/16

摘要： A plug assembly for use in the plug drawing of tubes and like hollow workpieces. In axial succession, from front to rear, the plug comprises three parts in fixed relationship to each other: a foremost first part with a smoothly rounded nose to make smooth and positive contact with the tube at the start of drawing, a parallel-sided middle part which sizes the interior section of the product as drawing proceeds, and a long rearmost part of larger section. During drawing the confronting surfaces of the rear part and the bore of the undrawn tube define a thin cylindrical clearance, relative movement between the walls of which exercises a hydrodynamic action upon lubricant lying within the tube rearward of the plug, forcing that lubricant forward through the clearance into the region where tube and plug first make contact. Alternative plug shapes for the third part of the plug are proposed, including parallel-sided, stepped and sloping.

摘要翻译： 一种用于管子和类似中空工件的插头图中的插头组件。 轴向连续地从前到后，塞子包括彼此固定关系的三个部分：最前面的第一部分具有平滑的圆形鼻部，以便在拉伸开始时与管子平滑地和正的接触，平行的中间部分 作为绘图进行时尺寸的产品的内部部分，以及较大部分的长的最后部分。 在拉伸后部的相对表面和未拉伸管的孔限定了薄的圆柱形间隙时，其壁之间的相对运动对位于塞子后面的管内的润滑剂进行流体动力作用，迫使润滑剂向前通过 清除进入管和插头首先接触的区域。 提出了插头的第三部分的替代插头形状，包括平行侧面，阶梯式和倾斜的。

公开(公告)号：US5313102A

公开(公告)日：1994-05-17

申请号：US455210

申请日：1989-12-22

申请人： Thiam B. Lim ,  Tadashi Saitoh ,  Boon Q. Seow

发明人： Thiam B. Lim ,  Tadashi Saitoh ,  Boon Q. Seow

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/28 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52

CPC分类号： H01L23/4951 ,  H01L23/3135 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92147 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121

摘要： A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a polyimide coating on its backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The polyimide coating on the backside of the integrated circuit helps to reduce package cracking arising from mounting the device to a printed circuit board by relflow solder.

摘要翻译： 公开了一种半导体封装器件。 在一个实施例中，通过其有源面连接到具有引线引脚的引线上引线框架是集成电路。 集成电路的背面有一个聚酰亚胺涂层。 封装材料围绕集成电路和引线框架引线框架，使得引线管暴露。 集成电路背面的聚酰亚胺涂层有助于减少通过回流焊接将器件安装到印刷电路板上的封装破裂。

公开(公告)号：US5227232A

公开(公告)日：1993-07-13

申请号：US644729

申请日：1991-01-23

申请人： Thiam B. Lim

发明人： Thiam B. Lim

IPC分类号： H01L23/495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49531 ,  H01L23/49558 ,  H01L23/49586 ,  H01L24/05 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/85207 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/20752

摘要： A conductive tape for a packaged semiconductor device is disclosed. The tape contains a first adhesive layer, a base film on top of the first adhesive layer, a conductive layer on top of the base film layer, and a second adhesive layer on top of the conductive layer. Metal may form the conductive layer. The tape may have slits, slots, or apertures in it so that electrical connection may be made to the conductive layer. Such a tape is useful in lead on chip integrated circuit packages to connect the semiconductor die to the lead frame and to function as a power supply bus by transferring power to the semiconductor die. Wire bonds extending through slots in the second adhesive layer form electrical connection from the lead fingers for receiving power to the conductive layer of the tape. Wire bonds extending from the bonding pads of the semiconductor die through slots the second adhesive layer form electrical connection from the semiconductor die to the conductive layer.

摘要翻译： 公开了一种用于封装半导体器件的导电胶带。 胶带包含第一粘合剂层，位于第一粘合剂层顶部的基膜，基膜层顶部的导电层，以及在导电层顶部的第二粘合剂层。 金属可以形成导电层。 胶带可以在其中具有狭缝，槽或孔，使得可以对导电层进行电连接。 这种磁带在片上集成电路封装中可用于将半导体管芯连接到引线框架，并通过将功率传递到半导体管芯来用作电源总线。 延伸穿过第二粘合剂层中的狭缝的引线键从引线指形成电连接，用于将功率接收到带的导电层。 从半导体管芯的接合焊盘延伸通过狭缝的引线键，第二粘合层形成从半导体管芯到导电层的电连接。

公开(公告)号：US5319241A

公开(公告)日：1994-06-07

申请号：US54930

申请日：1993-04-28

申请人： Thiam B. Lim

发明人： Thiam B. Lim

IPC分类号： H01L23/495 ,  H01L23/32

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49531 ,  H01L23/49558 ,  H01L23/49586 ,  H01L24/05 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/85207 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/20752

摘要： A conductive tape for a packaged semiconductor device is disclosed. The tape contains a first adhesive layer, a base film on top of the first adhesive layer, a conductive layer on top of the base film layer, and a second adhesive layer on top of the conductive layer. Metal may form the conductive layer. The tape may have slits, slots, or apertures in it so that electrical connection may be made to the conductive layer. Such a tape is useful in lead on chip integrated circuit packages to connect the semiconductor die to the lead frame and to function as a power supply bus by transferring power to the semiconductor die. Wire bonds extending through slots in the second adhesive layer form electrical connection from the lead fingers for receiving power to the conductive layer of the tape. Wire bonds extending from the bonding pads of the semiconductor die through slots the second adhesive layer form electrical connection from the semiconductor die to the conductive layer.

摘要翻译： 公开了一种用于封装半导体器件的导电胶带。 胶带包含第一粘合剂层，位于第一粘合剂层顶部的基膜，基膜层顶部的导电层，以及在导电层顶部的第二粘合剂层。 金属可以形成导电层。 胶带可以在其中具有狭缝，槽或孔，使得可以对导电层进行电连接。 这种磁带在片上集成电路封装中可用于将半导体管芯连接到引线框架，并通过将功率传递到半导体管芯来用作电源总线。 延伸穿过第二粘合剂层中的狭缝的引线键从引线指形成电连接，用于将功率接收到带的导电层。 从半导体管芯的接合焊盘延伸通过狭缝的引线键，第二粘合层形成从半导体管芯到导电层的电连接。

公开(公告)号：US5164815A

公开(公告)日：1992-11-17

申请号：US730381

申请日：1991-07-15

申请人： Thiam B. Lim

发明人： Thiam B. Lim

IPC分类号： H01L23/495 ,  H01L29/06

CPC分类号： H01L23/49558 ,  H01L23/4951 ,  H01L23/49555 ,  H01L29/0657 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815

摘要： A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a roughened backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The roughened backside surface helps to reduce package cracking arising from mounting the device to a printed circuit board by reflow solder.

摘要翻译： 公开了一种半导体封装器件。 在一个实施例中，通过其有源面连接到具有引线引脚的引线上引线框架是集成电路。 集成电路具有粗糙的背面。 封装材料围绕集成电路和引线框架引线框架，使得引线管暴露。 粗糙的背面有助于减少通过回焊焊接将器件安装到印刷电路板上的封装破裂。

公开(公告)号：US5146312A

公开(公告)日：1992-09-08

申请号：US662085

申请日：1991-02-28

申请人： Thiam B. Lim

发明人： Thiam B. Lim

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49586 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/85207 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20752

摘要： An insulated lead frame is disclosed. The lead frame has a first plurality of lead fingers and a second plurality of lead fingers. It also has a power supply bus lying between the first plurality of lead fingers and the second plurality of lead fingers. An insulating strip lies on a face of the power supply bus near an edge of the face. Examples of a suitable dielectric strip are an adhesive type tape, such as a polyimide tape, and a nonconductive liquid, such as liquid polyimide. An insulated lead frame is useful in the manufacture of packaged semiconductor integrated circuit devices to reduce the possibility of wire bond shorting to the power supply busses. One example is a dynamic random access memory, DRAM, die having centrally disposed bonding pads mounted to a lead on chip lead frame. The power supply busses of the lead on chip lead frame have dielectric strips running along their edges to reduce the possibility of shorting between the power supply busses and the crossing wire bonds that connect the lead fingers of the lead frame to the bonding pads of the DRAM.