公开(公告)号：US09947988B2

公开(公告)日：2018-04-17

申请号：US15230348

申请日：2016-08-05

Applicant: Thin Film Electronics ASA

Inventor： Mao Takashima ,  Aditi Chandra ,  Somnath Mukherjee ,  Gloria Wong ,  Khanh Van Tu ,  Joey Li ,  Anton Popiolek ,  Arvind Kamath

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q7/06

CPC classification number: H01Q1/2291 ,  H01Q7/06

Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.