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公开(公告)号：US20100053890A1
公开(公告)日：2010-03-04
申请号：US12202619
申请日：2008-09-02
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781
摘要： An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.
摘要翻译： 电子部件系统机柜包括多个电子部件系统托架以及安装在多个电子部件系统托架中的各个电子部件系统托架中的多个电子部件系统。 电子部件系统柜还包括包括多个冷却剂储存器的冷却系统。 多个冷却剂储存器中的每一个与多个电子元件系统托架中的至少一个相关联。 冷却系统还包括流体地连接到多个冷却剂储存器中的每一个的至少一个泵。 所述至少一个泵被选择性地操作以将供应的冷却剂循环到多个冷却剂储存器中的每一个。
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公开(公告)号：US07872867B2
公开(公告)日：2011-01-18
申请号：US12202619
申请日：2008-09-02
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781
摘要： An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.
摘要翻译： 电子部件系统机柜包括多个电子部件系统托架以及安装在多个电子部件系统托架中的各个电子部件系统托架中的多个电子部件系统。 电子部件系统柜还包括包括多个冷却剂储存器的冷却系统。 多个冷却剂储存器中的每一个与多个电子元件系统托架中的至少一个相关联。 冷却系统还包括流体地连接到多个冷却剂储存器中的每一个的至少一个泵。 所述至少一个泵被选择性地操作以将供应的冷却剂循环到所述多个冷却剂储存器中的每一个。
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公开(公告)号：US08659898B2
公开(公告)日：2014-02-25
申请号：US13568720
申请日：2012-08-07
IPC分类号： H05K7/20
CPC分类号： H01L25/0657 , H01L23/473 , H01L2224/16 , H01L2225/06513 , H01L2225/06589
摘要： The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for configuring of such an integrated circuit stack (1) by optimizing a configuration of the cooling layer (3).
摘要翻译： 本发明涉及包括多个集成电路层（2）和布置在两个电路层（2）之间的空间中的至少一个冷却层（3）的集成电路堆叠（1）。 使用泵送通过冷却层（3）的冷却流体（10）来冷却集成电路堆（1）。 本发明还涉及通过优化冷却层（3）的配置来配置这种集成电路堆叠（1）的方法。
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公开(公告)号：US08363402B2
公开(公告)日：2013-01-29
申请号：US12678298
申请日：2008-09-17
IPC分类号： H05K7/20
CPC分类号： H01L25/0657 , H01L23/473 , H01L2224/16 , H01L2225/06513 , H01L2225/06589
摘要： The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).
摘要翻译： 本发明涉及包括多个集成电路层（2）和布置在两个电路层（2）之间的空间中的至少一个冷却层（3）的集成电路堆叠（1）。 使用泵送通过冷却层（3）的冷却流体（10）来冷却集成电路堆（1）。 本发明还涉及一种用于优化这种集成电路堆叠（1）的配置的方法。
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公开(公告)号：US20120331433A1
公开(公告)日：2012-12-27
申请号：US13568720
申请日：2012-08-07
IPC分类号： G06F17/50
CPC分类号： H01L25/0657 , H01L23/473 , H01L2224/16 , H01L2225/06513 , H01L2225/06589
摘要： The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).
摘要翻译： 本发明涉及包括多个集成电路层（2）和布置在两个电路层（2）之间的空间中的至少一个冷却层（3）的集成电路堆叠（1）。 使用泵送通过冷却层（3）的冷却流体（10）来冷却集成电路堆（1）。 本发明还涉及一种用于优化这种集成电路堆叠（1）的配置的方法。
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公开(公告)号：US07532475B2
公开(公告)日：2009-05-12
申请号：US11394007
申请日：2006-03-30
CPC分类号： H01L23/3733 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.
摘要翻译： 提供了一种应力释放热界面，用于在保持可靠的热和机械接触的同时，防止多芯片模块（MCM）中芯片和散热片表面之间的应力增大。 该接口通过使用附接到芯片和散热器表面的柔性互锁柱来实现增强的热传导。
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公开(公告)号：US20100044005A1
公开(公告)日：2010-02-25
申请号：US12194973
申请日：2008-08-20
IPC分类号： B60H1/32
CPC分类号： H05K7/20272 , H05K7/20872
摘要： A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass.
摘要翻译： 用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器，流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。 响应于移动电子系统的加速度和取向变化中的至少一个，质量沿着至少一个轴线移动。 冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。 力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。
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公开(公告)号：US20120273183A1
公开(公告)日：2012-11-01
申请号：US13546612
申请日：2012-07-11
IPC分类号： F28F27/00
CPC分类号： H05K7/20272 , H05K7/20872
摘要： A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass. A gear member is operatively connected between the mass and the force transfer member.
摘要翻译： 用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器，流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。 响应于移动电子系统的加速度和取向变化中的至少一个，质量沿着至少一个轴线移动。 冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。 力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。 齿轮构件可操作地连接在质量块和力传递构件之间。
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公开(公告)号：US08796535B2
公开(公告)日：2014-08-05
申请号：US13250825
申请日：2011-09-30
申请人： Ryan J. Linderman
发明人： Ryan J. Linderman
IPC分类号： H01L31/042 , H02N6/00
CPC分类号： G05D3/105 , F24S50/20 , H01L31/048 , H01L31/0547 , H02S20/32 , Y02E10/47 , Y02E10/52
摘要： A thermal tracking system for a concentrating photovoltaic system is disclosed. The thermal tracking system comprises a photovoltaic receiver. The photovoltaic receiver comprises a photovoltaic laminate and a heat spreader. The thermal tracking system further comprises first and second thermal sensors coupled to the photovoltaic laminate and sensing two temperatures of the laminate. The thermal tracking system also comprises third and fourth thermal sensors positioned adjacent the heat spreader and sensing two temperatures near the heat spreader.
摘要翻译： 公开了一种集中光伏系统的热跟踪系统。 热跟踪系统包括光电接收器。 光伏接收器包括光伏层压板和散热器。 热跟踪系统还包括耦合到光伏层压板并感测层压板的两个温度的第一和第二热传感器。 热跟踪系统还包括位于散热器附近的第三和第四热传感器，并感测散热器附近的两个温度。
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10.发明授权Variable flow computer cooling system for a data center and method of operation 有权数据中心的可变流量计算机冷却系统和操作方法公开(公告)号：US08107234B2
公开(公告)日：2012-01-31
申请号：US12793896
申请日：2010-06-04
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20772 , Y10S165/908
摘要： Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.
摘要翻译： 这里公开了具有多个液冷计算机系统的数据中心。 计算机系统各自包括与冷板相连的处理器，其允许直接液体冷却处理器。 冷板进一步布置成向处理器的不同部分提供适当的冷却流，从而较高的温度区域接收较大的冷却剂流速。 流量被可变地调整以反映不同的活动水平。 通过使离开计算机系统的冷却剂温度最大化，系统可以利用环境空气的自由冷却温度并且消除对冷却器的需要。 还提供了一个与区域供热系统相结合的数据中心，从计算机系统中提取热量用于抵消碳排放，降低数据中心的总体拥有成本。
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